Thermal Test Chips on Display at SEMI-THERM

March 13th, 2015

Thermal Engineering Associates (TEA) will display Thermal Test Chips and Wafers at SEMI-THERM at booth 300. The wafers on display range from 200mm and 300mm and thicker ones range from 700mm to 800mm. Thinner wafers will…read more

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Charged Graphene Called ‘Molecular Gymnastics’

October 28th, 2014

A team of researchers at the University of Illinois set out to study charged graphene and to uncover a method to control DNA movement through a sequencing device. During their experiments, physics professor Aleksei Aksimentiev…read more

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New Thermal Management Material Produced

October 27th, 2014

Element Six has introduced its new thermal grade of CVD Diamond, named the Diafilm TM130. This CVD Diamond’s main purpose is management of semiconductor heat. The Diafilm TM130, which was grown by chemical vapor deposition,…read more

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Carbon Nanotubes Prove to Be Beneficial Semiconductors

October 10th, 2014

A group of researchers from the University of Texas at Austin and Northwestern University have discovered that carbon nanotubes, a semiconductor material, improve performance and reliability of transistors and circuits. These nanotubes are a better…read more

Graphene Improves Touchscreen Technology

October 10th, 2014

Most touch screen technology in electronic devices today, such as smartphones and tablets, are made of an expensive and inflexible material known as Indium Tin Oxide. A group of researchers from the University of Surrey…read more

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New HyperFlash Introduced

October 9th, 2014

Netzsch has just announced its new Light Flash Apparatus – the LFA 467 HyperFlash. “The Flash method is a fast, non-contact, and efficient method for measuring the three fundamental thermophysical properties of thermal diffusivity, specific…read more

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New Thermoelectric Devices Establish Beneficial Uses for Waste Heat

September 8th, 2014

Researchers estimate that more than half of the energy generated in the U.S from vehicles, machinery and heavy equipment is wasted as heat when it escapes into the air. Gang Chen, the Carl Richard Soderberg…read more

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New 4G Roaming Technology Must Account for Thermal Loss, Say Researchers

August 26th, 2014

According to Danish researchers, the push towards global 4G roaming and high-quality, frequency-reconfigurable antennas will need to account for new loss capacities not taken into account by previous technology. The worldwide demand for 4G technology…read more

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Scientists Explore the Pseudogap Phase of High-Temperature Superconductors

July 24th, 2014

Physicists at Binghamton University have identified an important feature of the pseudogap phase of copper-oxide high-temperature superconductors – a remarkable density wave state that may be a trait of all cuprates. The research, published this…read more

New Device to Cool Chips at the Micro-Scale

June 19th, 2014

Researchers at the University of California, Berkeley and the University of California, San Diego have developed a novel evaporator structure that can be integrated directly into electronics to cool chips with micro-sized components. “The idea…read more

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Built-in Heat Spreading for Efficient Thermoelectric Cooling of Concentrated Heat Loads

May 29th, 2014

Jeff Hershberger, Robert Smythe, Xiaoyi Gu and Richard F. Hill Laird Technologies, Inc. INTRODUCTION Thermoelectric cooling is an active thermal management technique.  A thermoelectric cooler (TEC) has two circuit boards which are typically Al2O3 plates…read more

Estimating the Thermal Interaction between Multiple Side-by-Side Chips on a Multi-Chip Package

May 29th, 2014

Je-Young Chang and Ashish Gupta Intel Corporation INTRODUCTION Integration using multi-chip packaging (MCP) is an effective and popular technology option to increase transistor density in one component by integrating two or more dice or other…read more

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Graphene Improves Copper Film Thermal Conductivity

March 11th, 2014

The placement of a single atomic plane of graphene on the surface of a copper film can significantly increase the film’s thermal conductivity, making the hybrid material ideal for more demanding thermal management applications, according…read more

Thermal Management of Many-Core Processors Using Power Multiplexing

December 19th, 2013

Man Prakash Gupta and Satish Kumar G.W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology INTRODUCTION Due to the growing demands of higher performance and faster computing, the number of cores in a microprocessor…read more