New Thermoelectric Devices Establish Beneficial Uses for Waste Heat

September 8th, 2014

Researchers estimate that more than half of the energy generated in the U.S from vehicles, machinery and heavy equipment is wasted as heat when it escapes into the air. Gang Chen, the Carl Richard Soderberg…read more

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New 4G Roaming Technology Must Account for Thermal Loss, Say Researchers

August 26th, 2014

According to Danish researchers, the push towards global 4G roaming and high-quality, frequency-reconfigurable antennas will need to account for new loss capacities not taken into account by previous technology. The worldwide demand for 4G technology…read more

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Scientists Explore the Pseudogap Phase of High-Temperature Superconductors

July 24th, 2014

Physicists at Binghamton University have identified an important feature of the pseudogap phase of copper-oxide high-temperature superconductors – a remarkable density wave state that may be a trait of all cuprates. The research, published this…read more

New Device to Cool Chips at the Micro-Scale

June 19th, 2014

Researchers at the University of California, Berkeley and the University of California, San Diego have developed a novel evaporator structure that can be integrated directly into electronics to cool chips with micro-sized components. “The idea…read more

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Built-in Heat Spreading for Efficient Thermoelectric Cooling of Concentrated Heat Loads

May 29th, 2014

Jeff Hershberger, Robert Smythe, Xiaoyi Gu and Richard F. Hill Laird Technologies, Inc. INTRODUCTION Thermoelectric cooling is an active thermal management technique.  A thermoelectric cooler (TEC) has two circuit boards which are typically Al2O3 plates…read more

Estimating the Thermal Interaction between Multiple Side-by-Side Chips on a Multi-Chip Package

May 29th, 2014

Je-Young Chang and Ashish Gupta Intel Corporation INTRODUCTION Integration using multi-chip packaging (MCP) is an effective and popular technology option to increase transistor density in one component by integrating two or more dice or other…read more

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Graphene Improves Copper Film Thermal Conductivity

March 11th, 2014

The placement of a single atomic plane of graphene on the surface of a copper film can significantly increase the film’s thermal conductivity, making the hybrid material ideal for more demanding thermal management applications, according…read more

Thermal Management of Many-Core Processors Using Power Multiplexing

December 19th, 2013

Man Prakash Gupta and Satish Kumar G.W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology INTRODUCTION Due to the growing demands of higher performance and faster computing, the number of cores in a microprocessor…read more

Use of JEDEC Thermal Metrics in Calculating Chip Temperatures (without Attached Heat Sinks)

December 19th, 2013

Bruce Guenin Assoc. Technical Editor, Electronics Cooling INTRODUCTION JEDEC single-chip package thermal metrics are widely used as a means of characterizing the thermal performance of semiconductor packages. They correlate the peak temperature of a uniformly-heated…read more

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Magnetic Field Created Using Heat in First Magnetic Seebeck Effect Demo

October 18th, 2013

In a research breakthrough, scientists from the École Polytechnique Fédérale de Lausanne (Swiss Federal Institute of Technology in Lausanne) in Switzerland claim to have provided the first evidence ever that it is possible to generate…read more

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Patent Covers Methods of Making, Cooling Semiconductor Packages

October 7th, 2013

The U.S. Patent and Trademark Office has awarded patent No. 8,546,935, “Semiconductor Packages,” to Micron Technology, Inc. of Boise, Idaho. According to background information provider by the inventors, the patent covers “semiconductor packages having grooves…read more

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Discovery Could Change Textbook Models on Heat Transfer

July 22nd, 2013

A new discovery in the physics of heat transmission along nanowires could rewrite the models of heat transfer in current textbooks and bring major changes to the electronics industry. Researchers at the National Taiwan University’s…read more

Nano-Scale Transistors May Lift Heat Dissipation Limit in Tiny Electronics

June 24th, 2013

A quantum-tunneling device created without semiconducting materials by scientists at Michigan Technological University could find use as a nano-scale transistor in tiny future electronic devices. As electronic devices continue to become progressively smaller and more…read more

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Nanoscale Device Recycles Waste Heat into Power

March 7th, 2013

Researchers from the University of Rochester in New York have proposed a “new type of nanoscale engine” that recycles heat emitted from a device and uses it to power the same device. According to Andrew…read more

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