Researchers at the Niels Bohr Institute have discovered a new method for laser cooling semiconductor membranes. Semiconductors are vital components in solar cells, LEDs and many other electronics, and the efficient cooling of components is…read more
ElectronicsCooling December 2011 Issue
December 1st, 2011
Don’t miss out on the December 2011 issue of ElectronicsCooling, which includes feature articles on data center design, electro-thermal simulation of power, energy reduction and performance maximization as well as technical briefs. If you would…read more
Companies Team Up to Develop Adhesives to Create 3D Semiconductors
September 27th, 2011
3M and IBM plan to jointly develop the first adhesives that can be used to package semiconductors into densely stacked silicon “towers.” The companies are aiming to create a new class of materials, which will…read more
Groups Develop Thermal Nanotape for Packaging
February 4th, 2011
(a) A nanostructured interface material is used around the module; (b) a nanostructured interface material is used between the thermoelectric material and metal leads. Semiconductor Research Corporation (SRC) and researchers from Stanford University have developed…read more
LED Lighting Reference Designs with IC Houses
November 9th, 2010
Working closely with various IC manufacturers, Wurth Electronics Midcom released several new transformers and inductors designed for LED lighting applications. These components maximize operational efficiency while maintaining a compact size for small form factor circuit…read more
Analysis System Ensures Optimal Heat Sink Efficiency
October 25th, 2010
The new Tactilus® heat-sink analysis system by Sensor Products Inc. enables research and design engineers to quickly and precisely test and correct the surface contact and pressure distribution between the heat sink and semiconductor. With Tactilus, engineers…read more
Reinforced TIM Integrates Nylon Mesh Layer
September 28th, 2010
Fujipoly released Sarcon 100GR-FL, a low resistance, durable thermal interface gap filler pad. The gel-like material is manufactured with an integrated nylon mesh layer that prevents distortion and stretching during die-cut operations. When placed between…read more
Making Sure Your Chips Don’t Burn
September 28th, 2010
Researchers at the Tyndall National Institute at University College Cork in Ireland have found a new way of cooling semiconductors in computers, mobiles and games consoles to improve their performance and reduce energy consumption. Most…read more
Industry Analyst Names Firm a ‘Cool Vendor’
June 7th, 2010
iWatt Inc., a developer of energy-efficient digital power supply control integrated circuits (ICs), recently was recognized in Gartner’s “Cool Vendors in Semiconductors” report. The company advances “digital power management” with its patented Adaptive Digital Control…read more
ElectronicsCooling Spring 2010 Print Issue
April 30th, 2010
Did you miss us? For those of you that are faithful readers of Electronics Cooling, we are pleased to inform you that after a short interval of restructuring, we have resumed publication. Given the recent downturn in…read more
IC Package Thermal Characterization Made Easy
April 13th, 2010
FloTHERM® IC is a new Web-based tool from Mentor Graphics that incorporates a high level of automation for key tasks related to semiconductor thermal characterization and design. Developed with the needs of design engineers and…read more
THERMINATOR Project Warms Efforts to Cool Semiconductor Design Solutions
April 12th, 2010
The partners in a new EU-funded research project recently announced details of the multinational/multidisciplinary program: “THERMINATOR: Modeling, Control and Management of Thermal Effects in Electronic Circuits of the Future.” This three-year project is designed to…read more
Solution for Semiconductor Package Thermal Design
February 26th, 2010
Mentor Graphics Corporation has announced the FloTHERM IC productivity tool targeting the semiconductor industry for thermal characterization and design. Addressing increased complexity, chip density, and high-speed requirements for today’s silicon designs, the FloTHERM IC solution…read more
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