Test & Measurement

New Accelerometer Eliminates Noise

March 23rd, 2015

PCB Piezotronics, Inc., announces a new crystal technology for use in high temperature applications – the Ultra High Temperature 1200 degrees Fahrenheit, or UHT-12™. “This new development solves the gas turbine manufacturers problem with ceramic based…read more

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New HyperFlash Introduced

October 9th, 2014

Netzsch has just announced its new Light Flash Apparatus – the LFA 467 HyperFlash. “The Flash method is a fast, non-contact, and efficient method for measuring the three fundamental thermophysical properties of thermal diffusivity, specific…read more

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Laser Cooling Yields More Sensitive Microscopes

August 19th, 2014

By cooling a nanowire probe using lasers, Australian scientists have discovered a way of dramatically improving atomic microscope sensitivity by up to 20 times, allowing them to register forces as small as that of an…read more

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Solder Joint Lifetime of Rapidly Cycled LED Components

May 29th, 2014

Wendy Luiten Philips Research, Eindhoven, the Netherlands INTRODUCTION Active LEDs in a consumer TV product are boosted and dimmed with the video picture content. Boosting and dimming of the LEDs is a powerful means to…read more

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Challenges in Measuring Theta jc for High Thermal Performance Packages

May 29th, 2014

Jesse Galloway and Ted Okpe Amkor Technology One of the more challenging thermal resistance measurements to make for electronic packages is the junction-to-case resistance called Theta jc. The equation for Theta jc, equation (1), is…read more

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Estimating the Thermal Interaction between Multiple Side-by-Side Chips on a Multi-Chip Package

May 29th, 2014

Je-Young Chang and Ashish Gupta Intel Corporation INTRODUCTION Integration using multi-chip packaging (MCP) is an effective and popular technology option to increase transistor density in one component by integrating two or more dice or other…read more

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Power Cycle and Thermal Testing of Electronic Components

May 12th, 2014

Mentor Graphics Corporation has released the new MicReD Industrial Power Tester 1,500A for power cycling and thermal testing of electronics components to simulate and measure lifetime performance. The MicReD Industrial Power Tester 1500A is ideal…read more

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Researchers Pinpoint Heat Movement in Nanostructures

March 25th, 2014

Researchers at Cornell University have developed a new method of precisely measuring the subtle movement of heat in nanostructures. Heat flows at the nanoscale differently than at larger scales, the researchers say, and understanding how…read more

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TTI Analyzers Offer Low-Cost Solution for Non-Invasive Thermal Design Verification

March 7th, 2014

Microsanj, a supplier of high-resolution thermoreflectance thermal imaging systems, tools and consulting services, has announced the availability of its NT100/NT110 thermoreflectance thermal image analyzers starting at $45,000. The availability of the NT100 sub-micon spatial resolution…read more

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Ultra-Thin Titanium Based Thermal Solution for Electronic Applications

February 28th, 2014

Payam Bozorgi and George Fleischman PiMEMS, Inc. Introduction As electronic system technology advances with continual increases in requirements leading to greater demand for higher power consumption, there have been growing challenges related to the design…read more

Posted in Computer, Design, Design, Heat Pipes, IT Products, Materials, Compounds, Adhesives, Substrates, Test & Measurement, TIMs | Comments Off on Ultra-Thin Titanium Based Thermal Solution for Electronic Applications

Potential Pitfalls of Hybrid Electrical-Thermal Measurements for Thermal Characterization

February 28th, 2014

Anurag Gupta, David H. Altman, Daniel P. Resler Raytheon Integrated Defense Systems Introduction Electrical resistors are often used to simulate heat-dissipating electronic devices in thermal characterization of semiconductor devices. This article describes a study in…read more

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Towards Reproducible ASTM D5470 Measurements at Lower Cost

February 28th, 2014

Baratunde A. Cola Georgia Institute of Technology INTRODUCTION  ASTM D5470 (updated to ASTM D5470-12 in 2012) [1] remains an industry standard for characterizing thermal interface materials (TIMs) despite some drawbacks. Ultimately, a TIM must be…read more

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Mobile Temperature Control System for Fast Thermal Testing of Electronics

December 16th, 2013

InTEST Thermal has released a new mobile temperature control system for high-speed thermal testing of electronics, sensors and assemblies. The Thermostream ATS-535 brings temperature to the test site by directing a stream of cooled or…read more

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New Thermal Modeling Programs Offer Wide Range of Application Simulations

November 22nd, 2013

Software designer Cradle Co., Ltd. has announced the release of version 11 of its SC/Tetra, scSTREAM/Heat Designer, and EOopti thermal modeling programs. SC/Tetra is the unstructured grid Computational Fluid Dynamics (CFD) software for simulations in…read more

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