Consumer

New USB Type-C Connectors and Cable Assemblies

May 2nd, 2016

Heilind Electronics has recently added Molex USB Type-C shielded I/O connectors and cable assemblies to its stock. The Type-C connectors offer a “more compact design” with “greater PCB savings, while allowing high-frequency mating in data,…read more

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Software Update Leads to Device Failure by Overheating

May 2nd, 2016

(April 29, 2016) The new Nextfit Robin, an Android-based smartphone, experienced a major cooling malfunction after a recent software update which resulted in the phones overheating. The device normally heats up a bit when performing everyday…read more

Posted in Blowers / Fans / Filters, Communications, Computer, Consumer, Coolers, Design, Design, News, Plastics, Power, Software/Modeling | Comments Off on Software Update Leads to Device Failure by Overheating

New System Improves Lead Times

April 18th, 2016

A manufacturer of thermoelectric air conditioners, TECA Corporation, has recently implemented a new program to improve lead times. President of TECA, Mike Mikalauskis, said, “We were able to pair new software with a more streamlined…read more

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New Market Entry of Sealed Enclosure Coolers

April 11th, 2016

As their “first step” into the sealed enclosure cooling market, Advanced Cooling Technologies (ACT) has recently launched its HSC, HPC and LNC series of sealed enclosure cooler products. ACT said this about each of their…read more

Posted in Communications, Consumer, Coolers, Defense, Enclosures, Free Air Cooling, Heat Exchanger, Heat Pipes, Heat Sinks, Medical, New Products | Comments Off on New Market Entry of Sealed Enclosure Coolers

Electrocaloric Polymers That Create On-Demand Cooling

April 11th, 2016

A team of researchers from Pennsylvania State University have recently developed a blend of ferroelectric polymers that could cool chips and small scale systems on demand. According to NewElectronics these are called electrocaloric materials, and…read more

Posted in Computer, Consumer, Coolers, Materials, Compounds, Adhesives, Substrates, News, Research, TECs | Comments Off on Electrocaloric Polymers That Create On-Demand Cooling

Smart Clothing That Automatically Cools Itself

April 4th, 2016

VTT Technical Research Centre of Finland Ltd has recently developed a technology that can be utilized in smart fabrics and clothing to cool or warm the wearer according to his or her needs as part…read more

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Diamonds May Take Silicon’s Place in Future Smartphones

March 28th, 2016

A startup called Akhan Semi suggests lab-grown diamonds can cool electronics more efficiently than silicon. Silicon costs a lot to keep cool, but lab-grown diamonds could eliminate cooling fans and heat sinks since they already…read more

Posted in Blowers / Fans / Filters, Communications, Computer, Consumer, Design, Design, Heat Sinks, News, Power, Research, Semiconductor | Comments Off on Diamonds May Take Silicon’s Place in Future Smartphones

Overcoming Cooling Challenges Downloadable Webinar Now Available

March 21st, 2016

The recent Electronics Cooling with Autodesk CFD Webinar on how to ensure proper cooling as the electronics used in products change and improve is now available for download. Exploring ‘invisible elements’ like airflow and heat…read more

Posted in Consumer, Coolers, Design, Design, Heat Exchanger, News, Plastics, Research, Semiconductor, Test & Measurement | Comments Off on Overcoming Cooling Challenges Downloadable Webinar Now Available

Registration for Thermal Conference Opens

March 21st, 2016

ITherm 2016 has now opened registration for the conference running from May 31 to June 3, 2016 at the Cosmopolitan Hotel in Las Vegas, Nevada. ITherm 2016 is the leading international conference for scientific and…read more

New 2D Semiconductor Performs Better Than Silicon

March 7th, 2016

A team of engineers from the University of Utah have discovered a new 2D semiconducting material that could outperform silicon, making electronics cooler and more efficient. “The semiconductor, made of the elements tin and oxygen,…read more

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Higher Temperature Rated MLC Capacitors Announced

March 1st, 2016

Knowles brand, Dielectric Laboratories (DLI), has taken temperature performance to a level of 175°C in their Ultra-low ESR and High Q MLC capacitors. DLI detailed the following: “UL is an EIA Class I Stable TC,…read more

Posted in Aerospace, Automotive, Ceramics, Computer, Consumer, Data Centers, Defense, Design, Industrial, Medical, New Products | Comments Off on Higher Temperature Rated MLC Capacitors Announced

New Smartphone to Use Heat Pipe Cooling

March 1st, 2016

Samsung has declared that the new Galaxy S7 will use heat pipes for its cooling system. Smartphones typically lack ventilation holes and fans, so smartphone companies are moving to adopt heat pipes “because the technology…read more

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Fan Designs New Smartphone That Uses Liquid Cooling

February 19th, 2016

An Asus fan has conceptualized his ideal gaming Asus smartphone, naming it the “Asus Z2 Poseidon”. “…The smartphone is said to come with a factory-installed Fujitsu-manufactured liquid cooling setup, something that is usually seen in…read more

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New Liquid Cooled HPC Cluster Launched

February 8th, 2016

CoolIT Systems has successfully completed the second deployment of its Rack DCLC™ liquid cooling solution at the Poznan Supercomputing and Networking Center (PSNC) in partnership with Huawei. The liquid cooled solution is part of the HPC…read more

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