Consumer

Company Brings Liquid Cooling Technology to Smartphones

April 27th, 2015

Reducing size of liquid cooling systems has been a challenge for companies in the electronics cooling industry for many years.  Fujitsu introduces a 1mm thick liquid cooling heat pipe for compact electronic devices such as…read more

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Free Giveaway for Naming TIM or Connector Products

April 24th, 2015

Fujipoly is hosting a gift giveaway. On June 5, an engineer will win his/her choice of a free Samsung Galaxy Tab Pro, Apple iPhone 6, or a $500 American Express Giftcard, in Fujipoly America Corporation’s…read more

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Engineer Develops Nanoscale Pillars to Produce More Efficient Electronics

April 14th, 2015

Seong Jin Koh, an engineer from the University of Texas at Arlington, has received a $300,000 grant that will allow him to build nanoscale pillars, which will lead to more energy-efficient transistors in electronic devices.…read more

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Thermal Foil Sheets Offer Advanced Thermal Management in Smartphones

April 13th, 2015

Angstron Materials Inc. has developed a family of thermal foil products ideal for smartphones, and other hand-held devices. The new thermal foil sheets have a thickness of from 5 um to 40 um and thermal…read more

Thermoelectric Coolers Ideal for Cooling Mobile Devices in All Environments

April 13th, 2015

EIC Solutions Inc. introduces a product line of Auto-ranging (M105) Thermoelectric Air Conditioners. The ThermoTEC 141, 145 and 151 series have auto ranging power capabilities. The auto ranging feature is ideal for cooling mobile devices…read more

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ASU Engineer’s Computing Node Research Suggests Large Reduction in Energy Usage

April 7th, 2015

Carole-Jean Wu, computer scientist and engineer at Arizona State University, is gaining recognition for her work to improve energy efficiency of computing nodes, which includes everything from smartphones and tablets, to desktop processors and data…read more

Combination of Polymers Yields Advantages for Electronics Manufacturers and Lighting Industry

April 7th, 2015

The high cost of LED bulbs has resulted in manufacturers in the lighting industry to reduce costs and improve performance in the assembly process. Nicolas Sunderland, senior scientist, and Terry G. Davis, principal engineer of…read more

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Liquid Cooling in Mobile Devices Increases Heat Dissipation Speeds

March 24th, 2015

Fujitsu Engineers have reportedly discovered a better way to dissipate heat from mobile devices. By using liquid cooling, heat dissipation occurs five times faster than current dissipation methods. “It’s built a microscale heat pipe, less…read more

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Overheating Issues Stall Release of Sony’s Xperia Z4

March 24th, 2015

The release of Sony’s Xperia Z4 has been delayed due to heat dissipation issues in the Snapdragon 810 processor in the device. The Snapdragon 810 chip reportedly has overheating issues and Sony is working to…read more

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Lab Safety Improved with Quick Disconnect Couplings on Caps

November 10th, 2014

Colder Products Company introduces its BQ45GL series – 45mm caps with integrated quick disconnect couplings, which is a first in the market. “Adding quick disconnects to media bottles enhances the user experience when using laboratory…read more

Graphene Improves Touchscreen Technology

October 10th, 2014

Most touch screen technology in electronic devices today, such as smartphones and tablets, are made of an expensive and inflexible material known as Indium Tin Oxide. A group of researchers from the University of Surrey…read more

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Company’s Materials Aid in Production of Smartphones and Tablets

October 9th, 2014

Honeywell Performance Materials and Technologies has just announced its thermal interface materials have been used by other manufacturers to contribute towards the production of electronic devices. Because of Honeywell’s materials, these electronic devices have been…read more

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Physicists and Researchers Encounter New Discovery

September 22nd, 2014

A team of researchers at the University of Arkansas teamed up with a group of physicist from all over the world and have discovered important results after heating graphene. The teams discovered that by heating…read more

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New 4G Roaming Technology Must Account for Thermal Loss, Say Researchers

August 26th, 2014

According to Danish researchers, the push towards global 4G roaming and high-quality, frequency-reconfigurable antennas will need to account for new loss capacities not taken into account by previous technology. The worldwide demand for 4G technology…read more

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