Researchers at Arizona State University have announced a breakthrough in nanolaser technology that could enable electrically-powered nano-scale lasers to perform reliability at room temperature and facilitate their use in a variety of practical applications. While…read more
Nanolaser Technology Room-Temperature Breakthrough Could Facilitate Faster Computer Operation
April 22nd, 2013
Ball Bearing for Cooling Fan Motors Handles High-Speed Motor Operation
April 8th, 2013
NSK Ltd., a developer of industrial bearings, automotive bearings and modules and linear motion products, has released a high-performance ball bearing for cooling fan motors used in personal computers, data servers and communication base stations.…read more
Heat Sink with Embedded Fan Suitable for Low-Profile Applications
March 25th, 2013
Thermal solutions developer JARO Thermal has released the new “skive” cooler comprised of a 50x50x13 mm fan embedded inside a skived-copper-fin heat sink for low-profile applications including network interface cards, video graphic cards, PCI express…read more
High Performance Full-Cover Water Block is First for NVIDIA Tesla K20 Series Professional Computing Card
March 25th, 2013
Water cooling gear manufacturer EK Water Blocks has released EK-FCTK20, a high performance full-cover water block that is reportedly the world’s first water cooling solution for the NVIDIA Tesla K20 series professional computing card. According…read more
Apple Releases Software Update to Fix Fan Speed Problem in 2013 Retina MacBook Pro Models
March 21st, 2013
Apple has released a new software update designed to combat the emerging problem that many consumers are facing with the cooling fans inside early 2013 Retina MacBook Pro laptops. According to a growing number of…read more
Laptop Computer Smothered by Clothing Identified as Cause of House Fire
March 7th, 2013
Officials have identified a laptop computer that was left running while sitting on top of a pile of clothes as the cause of a fire that destroyed a house in St. Raphael, Prince Edward Island,…read more
GE Announces Dual Piezoelectric Cooling Jet Manufacturing Partnership
February 7th, 2013
General Electric has announced a partnership with semiconductor company Texas Instruments to manufacture the company’s dual piezoelectric cooling jet technology first unveiled in December 2012. According to General Electric, the dual piezoelectric cooling jet technology…read more
New CPU Coolers Win 2013 CES Innovation Awards
January 21st, 2013
Computer cooling product developer Zalman has introduced the new CNPS FX100 Cube fanless CPU cooler and CI Water Cooler. Both coolers received Innovations Design and Engineering awards at the 2013 Consumer Electronics Show in Las…read more
New Cooling Method Based on Military Fighter Jet Air Flow Technology
December 17th, 2012
Engineers at GE Global Research have unveiled a new method of moving air in order to cool consumer electronics based on technology used to improve air flow in military fighter jets. Tentatively known as a…read more
New Slim Profile Fans with High Cooling Performance
November 21st, 2012
Thermal solutions developer GELID Solutions has released two new slim profile fans, the Slim 12 UV Blue and the Slim 12 PL Blue, as part of its GAMER product line. According to VC Tran, marketing…read more
Apple Explores Use of Mechanical Fans in Portable Devices
November 20th, 2012
A patent filed recently by Apple revealed that the electronics company is exploring the use of mechanical fans in portable devices. Though current models of Apple’s iPhone and iPad utilize air cooling to maintain a…read more
Growing Use of Tablets May Foreshadow Change in Heat Sink Industry
October 1st, 2012
In the earliest days of personal computing, excess heat wasn’t a problem; any heat that was generated by the computer dissipated safely into the surrounding air. Even in the 1980s, a single fan was all…read more
Thin Cavity Fluidic Heat Exchanger
July 5th, 2012
Third Millennium Engineering has released a Thin Cavity Fluidic Heat Exchanger, a small volume, high performance method for cooling critical electronic devices at the chip, board, module, and system levels. Its high thermal performance originates…read more
Pre-Packaged Air Conditioned Enclosures for Electronics and Telecom Equipment
July 5th, 2012
EIC Solutions, Inc. has introduced a new series of air conditioned electronic/electrical enclosures. The new Pre-packaged Protector Series enclosures feature rugged metal construction and a built-in thermoelectric air conditioner. The thermoelectric cooling unit does not…read more
Recent Posts
- New Business Development Specialist Seeks Position
- ‘Advanced Composite Thermal Management Materials and Applications’ Webinar to Take Place
- Preventing Thermal & Vibration Failures in Electronic Equipment
- Thermoreflectance Thermal Imaging System for Quality Control and Reliability Analysis
- Software Suite Handles Massive Data Flows Generated by Thermal Sensors
- Nanolaser Technology Room-Temperature Breakthrough Could Facilitate Faster Computer Operation
- Nanoscale Heat Transfer Research Awarded Air Force Grant
- Thermal Characterization Tools for Testing and Evaluation of TIM Materials
Latest Issue
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the March 2013 issue
of Electronics Cooling, which includes feature articles on the Benefits and Drawbacks of Using Two-Phase Cooling Technologies in Military platforms, Measured Thermal Resistance of Microbumps in 3D Chip Stack, and more.
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