Consumer

Nanolaser Technology Room-Temperature Breakthrough Could Facilitate Faster Computer Operation

April 22nd, 2013

Researchers at Arizona State University have announced a breakthrough in nanolaser technology that could enable electrically-powered nano-scale lasers to perform reliability at room temperature and facilitate their use in a variety of practical applications. While…read more

Ball Bearing for Cooling Fan Motors Handles High-Speed Motor Operation

April 8th, 2013

NSK Ltd., a developer of industrial bearings, automotive bearings and modules and linear motion products, has released a high-performance ball bearing for cooling fan motors used in personal computers, data servers and communication base stations.…read more

Heat Sink with Embedded Fan Suitable for Low-Profile Applications

March 25th, 2013

Thermal solutions developer JARO Thermal has released the new “skive” cooler comprised of a 50x50x13 mm fan embedded inside a skived-copper-fin heat sink for low-profile applications including network interface cards, video graphic cards, PCI express…read more

High Performance Full-Cover Water Block is First for NVIDIA Tesla K20 Series Professional Computing Card

March 25th, 2013

Water cooling gear manufacturer EK Water Blocks has released EK-FCTK20, a high performance full-cover water block that is reportedly the world’s first water cooling solution for the NVIDIA Tesla K20 series professional computing card. According…read more

Apple Releases Software Update to Fix Fan Speed Problem in 2013 Retina MacBook Pro Models

March 21st, 2013

Apple has released a new software update designed to combat the emerging problem that many consumers are facing with the cooling fans inside early 2013 Retina MacBook Pro laptops. According to a growing number of…read more

Laptop Computer Smothered by Clothing Identified as Cause of House Fire

March 7th, 2013

Officials have identified a laptop computer that was left running while sitting on top of a pile of clothes as the cause of a fire that destroyed a house in St. Raphael, Prince Edward Island,…read more

GE Announces Dual Piezoelectric Cooling Jet Manufacturing Partnership

February 7th, 2013

General Electric has announced a partnership with semiconductor company Texas Instruments to manufacture the company’s dual piezoelectric cooling jet technology first unveiled in December 2012. According to General Electric, the dual piezoelectric cooling jet technology…read more

New CPU Coolers Win 2013 CES Innovation Awards

January 21st, 2013

Computer cooling product developer Zalman has introduced the new CNPS FX100 Cube fanless CPU cooler and CI Water Cooler. Both coolers received Innovations Design and Engineering awards at the 2013 Consumer Electronics Show in Las…read more

New Cooling Method Based on Military Fighter Jet Air Flow Technology

December 17th, 2012

Engineers at GE Global Research have unveiled a new method of moving air in order to cool consumer electronics based on technology used to improve air flow in military fighter jets. Tentatively known as a…read more

New Slim Profile Fans with High Cooling Performance

November 21st, 2012

Thermal solutions developer GELID Solutions has released two new slim profile fans, the Slim 12 UV Blue and the Slim 12 PL Blue, as part of its GAMER product line. According to VC Tran, marketing…read more

Apple Explores Use of Mechanical Fans in Portable Devices

November 20th, 2012

A patent filed recently by Apple revealed that the electronics company is exploring the use of mechanical fans in portable devices. Though current models of Apple’s iPhone and iPad utilize air cooling to maintain a…read more

Growing Use of Tablets May Foreshadow Change in Heat Sink Industry

October 1st, 2012

In the earliest days of personal computing, excess heat wasn’t a problem; any heat that was generated by the computer dissipated safely into the surrounding air. Even in the 1980s, a single fan was all…read more

Thin Cavity Fluidic Heat Exchanger

July 5th, 2012

Third Millennium Engineering has released a Thin Cavity Fluidic Heat Exchanger, a small volume, high performance method for cooling critical electronic devices at the chip, board, module, and system levels. Its high thermal performance originates…read more

Pre-Packaged Air Conditioned Enclosures for Electronics and Telecom Equipment

July 5th, 2012

EIC Solutions, Inc. has introduced a new series of air conditioned electronic/electrical enclosures. The new Pre-packaged Protector Series enclosures feature rugged metal construction and a built-in thermoelectric air conditioner. The thermoelectric cooling unit does not…read more