Defense

Researchers May Have Solved the Problem of Thermal Resistance for ICs

May 23rd, 2016

(May 18, 2016) Researchers at Lockheed Martin are further exploring the idea of microspraying hot integrated circuits (ICs) to cool their thermal resistance problem. EETimes.com reported, “The efforts are focused on gallium-nitride (GaN) power amplifiers…read more

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Thin “Super-Flow Micro” Fan Offers 0.60cfm

May 18th, 2016

JARO has recently released their newest Micro-Fan available with 0.60cfm. The fan measures 17x17x4 mm (at 15,000rpm), and offers a static pressure  of 2.413 mm H2O, according to JARO. With operating voltages from 2.8 to…read more

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New Availability of Data Matrix Codes (DMCs)

May 9th, 2016

Rogers has announced that they can add data matrix codes (DMCs) to a wide range of metalized substrates, including direct-bonded-copper and active-metal-brazed substrates. The codes can be “text or numeric in form and encoded by…read more

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Graphene Nanoflakes Better Dissipates Electronics’ Heat

May 2nd, 2016

(April 29, 2016) Recently, a team of researchers from Chalmers University of Technology in Sweden have developed a more efficient approach to cooling electronics using graphene nanoflake-based film. According to E&T, the team performed “experiments…read more

Posted in Aerospace, Automotive, Computer, Data Centers, Defense, Heat Exchanger, Industrial, IT Products, Materials, Compounds, Adhesives, Substrates, Medical, News, Research, Test & Measurement, TIMs | Comments Off on Graphene Nanoflakes Better Dissipates Electronics’ Heat

Potential Electronics Cooling Application of Carbon Nanotubes

April 25th, 2016

(April 21st, 2016) A technique has been found that could allow carbon nanotubes to be used in electronic cooling and as devices in microchips, sensors and circuits in the future. Phys.org reported that the technique…read more

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New Market Entry of Sealed Enclosure Coolers

April 11th, 2016

As their “first step” into the sealed enclosure cooling market, Advanced Cooling Technologies (ACT) has recently launched its HSC, HPC and LNC series of sealed enclosure cooler products. ACT said this about each of their…read more

Posted in Communications, Consumer, Coolers, Defense, Enclosures, Free Air Cooling, Heat Exchanger, Heat Pipes, Heat Sinks, Medical, New Products | Comments Off on New Market Entry of Sealed Enclosure Coolers

New Power Electronics Will Allow Army Vehicles’ Electronics to Operate at High Temperatures

April 4th, 2016

The US Army has awarded GE Aviation with a contract to develop silicon carbide-based power electronics that will allow high-voltage, next-generation ground vehicles to operate at higher temperatures. “The US Army’s implementation of [this technology…read more

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Registration for Thermal Conference Opens

March 21st, 2016

ITherm 2016 has now opened registration for the conference running from May 31 to June 3, 2016 at the Cosmopolitan Hotel in Las Vegas, Nevada. ITherm 2016 is the leading international conference for scientific and…read more

Cooling High-Powered Electronics with Tiny Drops of Water

March 21st, 2016

Lockheed Martin and the Defense Advanced Research Projects Agency (DARPA) Microsystems Technology Office (MTO) want to cool high-powered microchips with microscopic drops of water. “A core team of Lockheed Martin engineers is working on a…read more

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NSA Finally Has a Plan for Their Superconducting Supercomputer

March 7th, 2016

The U.S. government has its eyes on “cryogenically cooled circuitry for tomorrow’s exascale computers,” reported Spectrum.IEEE.org, a dream over 50 years old. An electrical engineer of the NSA, Dudley Buck, “reported on his own work”…read more

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Higher Temperature Rated MLC Capacitors Announced

March 1st, 2016

Knowles brand, Dielectric Laboratories (DLI), has taken temperature performance to a level of 175°C in their Ultra-low ESR and High Q MLC capacitors. DLI detailed the following: “UL is an EIA Class I Stable TC,…read more

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Scientists Grow Efficient Light-Emitting Organic Semiconductor Crystals

February 19th, 2016

Recently, scientists from the faculty of physics of the Moscow State University have grown organic semiconductor crystals with extremely high light-emitting efficiency that can reduce the cost of creating light, flexible, and transparent light-emitting electronic…read more

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Nominations Open for IEEE ITherm Achievement Award

February 8th, 2016

The biennial ITherm Achievement Award is open for nominations for 2016. The Award is presented in recognition of significant contributions made in thermal and thermomechanical management of electronics, of pioneering and sustaining electronics thermal/thermomechanical research…read more

Cooling Matters

September 16th, 2015

AIR FORCE INQUIRES ABOUT THERMAL MGMT.SOLUTIONS FOR FUTURE AIRCRAFT 8/11/15 – The U.S. Air Force is looking into new thermal management techniques to cool the electronics in future fighter aircraft. “Officials of the Air Force Research…read more