Avionics systems designers and systems integrators are faced with the challenge of size, weight, and power (SWaP) constraints. Commercial, business, and military aviation customers increasingly desire modern avionics—whether installing in new aircraft platforms, or retrofitting…read more
Conduction Cooled FPGA-Accelerated JPEG2000 Video Compression XMC Card
November 8th, 2011
Curtiss-Wright Controls Embedded Computing’s new conduction cooled (CC) variant of its popular XMC-280 JPEG2000 video compression XMC mezzanine card, XMC-280 CC, is an open standards-based module that speeds and simplifies the integration of high performance,…read more
Military Demands Propel Thermal Management Solutions
August 22nd, 2011
Military programs continue to push the limits of computing system requirements necessitating rugged computer systems to continue to evolve to endure the toughest conditions. To meet these requirements, rugged subsystems suppliers have to produce innovative…read more
Company Receives TMS Production Contract
August 8th, 2011
Parker Aerospace has signed a production contract for thermal management systems for the U.S. Air Force’s Global Hawk and U-2 reconnaissance aircraft. Northrop Grumman awarded a contract valued at more than $4 million for production…read more
Flexible Transparent Heaters for Temperature Control
August 5th, 2011
Dontech’s new Therma Klear Flex™ series of thin flexible transparent heaters for use in outdoor, military or avionic applications provide the warmth necessary to extend the operating temperature of LCDs in cold environments (0° to…read more
Wide Input Range 400 Watt DC DC Converter
August 5th, 2011
Calex Mfg. Co., Inc.’s new 400 Watt FBW DC DC Converter Series offers a 9-36 VDC and 18-75 VDC input range in a 4.6″ x 2.4″ x 0.55″ high package. The wide input range provides…read more
New 1.3M pixel, Mil-Hardened 1280 x 1024 Shortwave Infrared (SWIR) Camera
May 20th, 2011
Goodrich ISR Systems’ new 1.3 Mpixel, indium gallium arsenide (InGaAs) video camera, the GA-1280J-15A, offers the highest sensitivity available in a military-hardened NIR-SWIR camera. The new, high-resolution J-Series SWIR camera features 1280 x 1024 pixels,…read more
30 GHz Leadless Chip Carrier Packaging Platform
March 18th, 2011
Tektronix Component Solutions’ new 30 GHz leadless chip carrier packaging platform meets the broadband performance requirements demanded by telecommunications systems and modules, military/aerospace applications, and terrestrial communications. Tektronix Component Solutions’ LCC platform is suitable for…read more
Cold Plates for Demanding Military Cooling Applications
March 18th, 2011
Thermacore introduces a new line of cold plates that meet the most recent VME64x/VPX standards and supports commercial off-the-shelf packaging formats. With the thermal performance and flexibility these cold plates offer, military embedded system designers…read more
Researchers Developing Silver-Diamond Thermal Shim
March 4th, 2011
Researchers at the Georgia Tech Research Institute are developing a solid composite material, made of silver and diamond to cool small, powerful microelectronics used in defense systems. The diamonds provide the bulk of thermal conductivity,…read more
New Material Provides Greater Thermoelectric Conversion Efficiency
February 22nd, 2011
Automobiles, military vehicles, even large-scale power generating facilities may someday operate far more efficiently thanks to a new alloy developed at the U.S. Department of Energy’s Ames Laboratory. A team of researchers at the Lab…read more
Company Expands Data Center Capabilities with Acquisition
January 10th, 2011
Legrand, North America recently announced the purchase of Electrorack Products Company, an American company specializing in cabinets, power and cooling solutions. The demand for cabinets and accessories in data centers, broadcast and broadband, industrial and military/aerospace/shipboard markets…read more
New Small Form Factor Conduction Cooled Chassis
December 14th, 2010
Curtiss-Wright Controls Electronic Systems has introduced a new, rugged 6-slot 3U OpenVPX (or 7-slot 3U CompactPCI) conduction cooled chassis for harsh military environments. The SFF-6 Small Form Factor Chassis is the newest member of Electronic…read more
Military Electronics Thermal Management Challenges Spark Innovation
November 9th, 2010
Several trends are influencing thermal management in military and aerospace environments, including smaller electronic packages, components that fit into tighter spaces, and more powerful chips and IC packages. Packing more powerful components into smaller air-tight…read more
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