LED / Lighting

Nanodiamonds Boost Thermal Conductivity of Thermoplastics

July 18th, 2014

Carbodeon has announced the release of new nanodiamond-enhanced thermoplastics, which offer a 20-100 percent improvement in thermal conductivity compared to traditional materials. The new uDiamond® products can achieve a 20 percent increase in polymer thermal…read more

Phase-Change TIM Offers Good Alternative to Grease

July 7th, 2014

Universal Science has introduced a new phase change thermal interface material that offers a cleaner, more effective alternative to thermal grease. With 4.0 w/mK thermal conductivity, UniPhase 4000-COB is ideal for use in a wide…read more

Adhesive Cures at Temperatures as Low as 60°C

June 23rd, 2014

DELO, a manufacturer of industrial adhesives for automotive, consumer and industrial electronics applications, has released a new heat-curing adhesive that cures to full strength in temperatures as low at 60°C. The new DELOMONOPOX LT204 epoxy resin…read more

Thermal Adhesive Tape Reduces PCB Production Time

June 18th, 2014

Universal Science, a provider of thermal management solutions, has introduced a reflowable, thermally conductive adhesive tape designed for application during PCB manufacturing. Bondline 1000-Reflow can be laminated directly to PCBs prior to processing, enabling the…read more

Thermally Conductive Plastic for LED Heat Sinks Reduces Lighting Costs

June 4th, 2014

Bayer Material Science has announced Makrolon® polycarbonate as the latest addition to its family of heat-resistant plastics designed specifically for LED heat sink applications. Compared with aluminum, this grade of Makrolon polycarbonate conduct similar thermal performance…read more

Solder Joint Lifetime of Rapidly Cycled LED Components

May 29th, 2014

Wendy Luiten Philips Research, Eindhoven, the Netherlands INTRODUCTION Active LEDs in a consumer TV product are boosted and dimmed with the video picture content. Boosting and dimming of the LEDs is a powerful means to…read more

Thermal Material Provides Both Compressibility and Conformability with Phase-Change Ability

April 17th, 2014

AI Technology, Inc. has released COOL-PAD™ CPR7154, a thermal interface material that dispenses like a thermal pad but exhibits characteristics like that of a grease or gel when device temperatures increase to above 45°C. Ideal…read more

Polymer-Based Thermal Interface Material Cools Devices at 200°C

April 3rd, 2014

Scientists have developed a new polymer-based thermal interface material (TIM) capable of conducing heat 20 times better than conventional polymer. Reliable in temperatures of up to 200°C, the modified material can be fabricated on heat…read more

Non-Silicone Thermal Pad Offers Natural Tack, Good Insulation

March 10th, 2014

Tglobal Technology Co., Ltd. has released its new PC94 non-silicone thermally conductive pad. Ideal for electronic component, heat sink, LED and other thermal applications, the new soft pad features an acryl base, natural tack and…read more

New Dispensable Thermal Pads Offer Improved Heat Management, Greater Application Potential

December 5th, 2013

Dow Corning, a developer of silicon-based technology, has introduced new Dow Corning Dispensable Thermal Pads for use in LED, data server, telecommunications equipment and transportation thermal management applications. “Compared to traditional fabricated thermal pads, new…read more

New Gap Filler Offers Thermal Conductivity of 1.3W/m-K

November 22nd, 2013

The Bergquist Company has released the Gap Pad 1450 thermally-conductive gap filler. Designed to provide low strain on fragile components, the new gap filler is ideal for a variety of applications, including lighting and LED,…read more

Nanodiamond Filler Ups Conductivity of Thermally-Conductive Polymers

November 7th, 2013

Carbodeon, a supplier of superhard materials such as nano-diamonds and graphitic carbon nitride, has released a new thermally-conductive nanodiamond filler it claims increases the conductivity of thermally-conductive polymers by 25 percent. According to the company,…read more

Testing of Power LEDs: The Latest Thermal Testing Standards from JEDEC

September 13th, 2013

András Poppe, Ph.D.; Mentor Graphics MAD MicReD Unit   The electrical, thermal and optical parameters determining light emitting didoes (LEDs) operation are in a strong, mutual dependence; without knowledge about the parameters in one of…read more

Heat Pipe Integration Strategies for LED Applications

September 12th, 2013

Dr. Richard Bonner, Anqi (Angie) Fan, Daniel Pounds and Dr. Ehsan Yakhshi-Tafti; Advanced Cooling Technologies, Inc. INTRODUCTION In light-emitting diodes (LEDs), 70 percent to 80 percent of the applied electrical power is converted to waste…read more