LED / Lighting

Thermal Material Provides Both Compressibility and Conformability with Phase-Change Ability

April 17th, 2014

AI Technology, Inc. has released COOL-PAD™ CPR7154, a thermal interface material that dispenses like a thermal pad but exhibits characteristics like that of a grease or gel when device temperatures increase to above 45°C. Ideal…read more

Polymer-Based Thermal Interface Material Cools Devices at 200°C

April 3rd, 2014

Scientists have developed a new polymer-based thermal interface material (TIM) capable of conducing heat 20 times better than conventional polymer. Reliable in temperatures of up to 200°C, the modified material can be fabricated on heat…read more

Non-Silicone Thermal Pad Offers Natural Tack, Good Insulation

March 10th, 2014

Tglobal Technology Co., Ltd. has released its new PC94 non-silicone thermally conductive pad. Ideal for electronic component, heat sink, LED and other thermal applications, the new soft pad features an acryl base, natural tack and…read more

New Dispensable Thermal Pads Offer Improved Heat Management, Greater Application Potential

December 5th, 2013

Dow Corning, a developer of silicon-based technology, has introduced new Dow Corning Dispensable Thermal Pads for use in LED, data server, telecommunications equipment and transportation thermal management applications. “Compared to traditional fabricated thermal pads, new…read more

New Gap Filler Offers Thermal Conductivity of 1.3W/m-K

November 22nd, 2013

The Bergquist Company has released the Gap Pad 1450 thermally-conductive gap filler. Designed to provide low strain on fragile components, the new gap filler is ideal for a variety of applications, including lighting and LED,…read more

Nanodiamond Filler Ups Conductivity of Thermally-Conductive Polymers

November 7th, 2013

Carbodeon, a supplier of superhard materials such as nano-diamonds and graphitic carbon nitride, has released a new thermally-conductive nanodiamond filler it claims increases the conductivity of thermally-conductive polymers by 25 percent. According to the company,…read more

Testing of Power LEDs: The Latest Thermal Testing Standards from JEDEC

September 13th, 2013

András Poppe, Ph.D.; Mentor Graphics MAD MicReD Unit   The electrical, thermal and optical parameters determining light emitting didoes (LEDs) operation are in a strong, mutual dependence; without knowledge about the parameters in one of…read more

Heat Pipe Integration Strategies for LED Applications

September 12th, 2013

Dr. Richard Bonner, Anqi (Angie) Fan, Daniel Pounds and Dr. Ehsan Yakhshi-Tafti; Advanced Cooling Technologies, Inc. INTRODUCTION In light-emitting diodes (LEDs), 70 percent to 80 percent of the applied electrical power is converted to waste…read more

Multi-Purpose Cold Plates for TEC, LED and Semiconductor Cooling

September 9th, 2013

Custom liquid cooling solutions provider Koolance has released three new multi-purpose cold plates for heat sources ranging from 25-50 mm/sq. The three models— PLT-UN50F, PLT-UN40F and PLT-UN25F—are ideal for thermal applications such as thermoelectric cooling,…read more

New High Thermal Conductivity LED Die Attach Adhesive

September 9th, 2013

Engineered Material Systems, a supplier of electronic materials for circuit assembly applications, has released its CA-195 high thermal conductivity LED die attach adhesive for bonding LED and other small semiconductor die to silver and copper…read more

New Manufacturing Method for High Ratio Air-Cooled Extruded Aluminum Heat Sinks

August 26th, 2013

A new method for manufacturing high ratio air-cooled extruded aluminum heat sinks has been announced by Sapa Extrusions North America. Created by Sapa’s North American Technical Center (NATC), an internal research, design and development center,…read more

Thermal Pads Enhance LED/Luminaire Performance

August 12th, 2013

Silicon-based technology developer Dow Corning has released new dispensable thermal pads for more cost-effective thermal management in LED lighting applications. The new dispensable thermal pads “enable LED lamp and luminaire manufacturers to quickly and precisely…read more

Thermally Conductive Acrylic Interface Pads

July 8th, 2013

Electronic component distributor Digi-Key has announced the availability of 3M’s 5590H series thermally-conductive acrylic interface pads for effective heat transfer and vibration dampining in demanding thermal applications. According to the company, the new 5590H series…read more

DuPont Increases Thermal Substrate Production to Accommodate Demand

June 7th, 2013

DuPont Circuit & Packaging Materials, part of DuPont Electronics & Communications, announced earlier this week that it has increased production at its Hsinchu, Taiwan facility by more than seven times the previous amount to better…read more