Power

Liquid Cold Plate Cools Power Electronics

March 27th, 2014

Thermal management company GCoreLab has introduced a new generation of cold plates for the cooling of power electronics. The new XtremeChill liquid cold plate utilizes GCoreLab’s patented oblique fin technology, which offers superior thermal cooling…read more

Nanoscale Pillars May Improve Thermoelectric Materials

March 10th, 2014

Researchers at the University of Colorado Boulder say a new method of improving thermoelectric materials could lead to the development of better solar panels, more energy-efficient cooling equipment and effective devices that could turn waste…read more

Thermal Pad Offers Advantages of Thermal Grease Without Mess

March 3rd, 2014

AOS Thermal Compounds has released Micro-Faze, a new thermal interface material formulated with non-silicone thermal grease. Micro-Faze offers a number of technical advantages, including low thermal resistance with minimum force and conformance with coefficient of…read more

Thermoelectrically-Cooled Electronic Enclosure Line Expanded for More Applications

February 24th, 2014

EIC Solutions, a manufacturer of thermoelectric air conditioners, electronic enclosures and transit cases, has expanded its line of pre-packaged electronic enclosures with new sizes to meet more applications. Designed to protect and cool electronics and…read more

Electrical Field Facilitates Better Heat Transfer

January 9th, 2014

The application of an electric field to a condenser could double the efficiency of surface heat transfer in power plant and high performance computing cooling systems, according to new research released by scientists at MIT.…read more

New Fan Delivers High Static Pressure and Energy Reduction

December 16th, 2013

Sanyo Denki Co., Ltd. has introduced the new San Ace 92 DC fan to its DC fan lineup. Measuring 92 × 92 × 38 mm, the new fan delivers the industry’s highest static pressure and…read more

Thermoelectric Coolers for High Temperature Environments

November 22nd, 2013

Thermoelectric air conditioner supplier EIC Solutions has expanded its line of ThermoTEC thermoelectric coolers with the addition of a high ambient temperature model. Designed to cool electronic enclosures in extremely hot settings such as in…read more

New Surfaces Ease Dissipation of Extreme Heat

November 11th, 2013

A new method of cooling extremely hot surfaces more effectively from researchers at MIT could benefit industrial equipment and electronic devices. Considered by many to be a quieter, more efficient way of removing heat compared…read more

New Manufacturing Method for High Ratio Air-Cooled Extruded Aluminum Heat Sinks

August 26th, 2013

A new method for manufacturing high ratio air-cooled extruded aluminum heat sinks has been announced by Sapa Extrusions North America. Created by Sapa’s North American Technical Center (NATC), an internal research, design and development center,…read more

Heat Exchanger Research Could Lead to Better Liquid Cooling in Aerospace, Automotive, Defense Applications

August 26th, 2013

A New Mexico State University assistant professor is investigating methods of increasing heat exchanger efficiency that could enable space missions to remain in orbit for longer periods of time and lead to better automotive, defense,…read more

Researchers Identify Key Attribute in Surface Dissipation of Heat

July 22nd, 2013

New research from MIT that identifies the key attribute in surface dissipation of heat could lead to improved power plant efficiency and better cooling of high-power electronics. A team of MIT researchers has reportedly completed…read more

Liquid Silicone Adhesive Offers High Thermal Conductivity for Bonding Electronic Components

July 22nd, 2013

The Bergquist Company, a manufacturer of high-performance thermal management materials, has released Liqui-Bond SA 3505, a two-component, liquid silicone adhesive ideal for power supplies and discrete applications. With a high thermal conductivity of 3.5 W/m-K,…read more

Two-Phase Evaporative Liquid Cooling Systems for Renewable Energy Power Conversion Systems

May 23rd, 2013

Parker Hannifin Corporation, a developer of motion and control technologies, has released new two-phase evaporative liquid cooling systems for renewable energy power conversion systems. “The Parker system’s inherent cooling efficiency benefits can result total system cost…read more

New Customizable Heat Sinks for Use in High Power Environments and Resistors

March 11th, 2013

Ohmite Manufacturing, a provider of thermal solutions and resistors for high current, high voltage and high energy applications, has announced two new heat sinks: the C series modular heat sink for use in high power…read more