Ohmite Manufacturing, a provider of thermal solutions and resistors for high current, high voltage and high energy applications, has announced two new heat sinks: the C series modular heat sink for use in high power…read more
FV Fan for High Density Computer Servers and Power Supplies
January 21st, 2013
Thermal solutions provider JMC Products has released a new 36mm fixed vane fan for use in high density power supplies, 1U chassis and small high density enclosures. According to the company, the new fan produces…read more
New Sealed Charge Controller Does Not Require Cooling Fan
September 10th, 2012
OutBack Power Technologies, Inc., a leading designer and manufacturer of advanced power electronics for backup and renewable energy, has introduced the first sealed, outdoor- rated maximum power point tracking (MPPT) charge controller. Based on a…read more
New Thermo-Fluid Simulation Software for Power and Energy Markets
June 11th, 2012
Mentor Graphics Corporation announced the Flowmaster(R) Power and Energy version for system level thermo-fluid simulation. This new product provides a two-phase solution modeling the phase change from liquid to vapor for steam generation or from…read more
Global Energy Conservation Initiative for Wireless Industry
October 11th, 2011
As wireless networking companies push to become more environmentally friendly, CommScope, Inc. has launched an energy conservation initiative that supports the industry’s global efforts in reducing power consumption, greenhouse gas emissions and operating costs. It…read more
Two-Phase Cooling Technology Powered Rack for Wind Turbine Systems
June 13th, 2011
Parker Hannifin Corporation’s new precision cooled rack for cooling critical wind turbine systems features Parker’s patented two-phase evaporative cooling technology, which uses non-corrosive, non-conductive fluid, as it vaporizes and cools hot surfaces on contact. Parker’s…read more
New Snap-in Aluminum Electrolytic Capacitors
December 27th, 2010
TDK-EPC, a group company of TDK Corporation, has developed snap-in aluminum electrolytic capacitors from EPCOS that enable optimal contact to heat sinks. This permits link circuit capacitors to be efficiently cooled, significantly increasing their ripple current…read more
Thermal Paper Draws Top Award at PCIM Conference
May 10th, 2010
A paper on thermal aspects in power systems won a Young Engineer Award at this year’s PCIM (Power Electronics/Intelligent Motion/Power Quality) Europe Conference. The Young Engineer Award is presented to exceptional contributions from young professionals…read more
Study: Carbon Nanotubes Could be Used for New Energy Systems
May 10th, 2010
A team of scientists at Massachusetts Institute of Technology have discovered a previously unknown phenomenon that can cause powerful waves of energy to shoot through minuscule wires known as carbon nanotubes. The discovery could lead…read more
Health Assessment and Prognostics of Electronic Products: An Alternative to Traditional Reliability Prediction Methods
May 9th, 2009
Introduction Traditional handbook-based reliability prediction methods for electronic products include Mil-Hdbk-217, Telcordia SR-332 (formerly Bellcore), PRISM, FIDES, CNET/RDF (European), and the Chinese GJB-299. These methods rely on analysis of failure data collected from the field…read more
LED Thermal Standardization: A Hot Topic
May 9th, 2009
Introduction The main topic of the article is how to cope with the increasing need for standardization of thermal characterization of LEDs (Light Emitting Diodes) and LED-based products (see Fig.1 showing a typical LED package).…read more
Numerical Simulation of Complex Submicron Devices
May 1st, 2009
Introduction Significant increases in temperature are believed to contribute to losses in reliability and performance, and can present serious complications to thermal management. The net thermal effect depends on a combination of factors related to…read more
en Route to a Greener Thermal Technology
February 1st, 2008
It’s no surprise. Power levels in the data center keep rising. In fact, the cost of powering the computers in the data center is beginning to exceed the cost of the computers themselves. The computer…read more
Cooling Options And Challenges Of High Power Semiconductor Modules
November 1st, 2006
Introduction Trends in power electronics systems and devices over the last decade have placed increasing demands on the efficiencies of the thermal management systems used for power Metal Oxide Semiconductor Field-Effect Transistor (MOSFET) and Insulated…read more
Recent Posts
- New Business Development Specialist Seeks Position
- ‘Advanced Composite Thermal Management Materials and Applications’ Webinar to Take Place
- Preventing Thermal & Vibration Failures in Electronic Equipment
- Thermoreflectance Thermal Imaging System for Quality Control and Reliability Analysis
- Software Suite Handles Massive Data Flows Generated by Thermal Sensors
- Nanolaser Technology Room-Temperature Breakthrough Could Facilitate Faster Computer Operation
- Nanoscale Heat Transfer Research Awarded Air Force Grant
- Thermal Characterization Tools for Testing and Evaluation of TIM Materials
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