As wireless networking companies push to become more environmentally friendly, CommScope, Inc. has launched an energy conservation initiative that supports the industry’s global efforts in reducing power consumption, greenhouse gas emissions and operating costs. It…read more
Two-Phase Cooling Technology Powered Rack for Wind Turbine Systems
June 13th, 2011
Parker Hannifin Corporation’s new precision cooled rack for cooling critical wind turbine systems features Parker’s patented two-phase evaporative cooling technology, which uses non-corrosive, non-conductive fluid, as it vaporizes and cools hot surfaces on contact. Parker’s…read more
New Snap-in Aluminum Electrolytic Capacitors
December 27th, 2010
TDK-EPC, a group company of TDK Corporation, has developed snap-in aluminum electrolytic capacitors from EPCOS that enable optimal contact to heat sinks. This permits link circuit capacitors to be efficiently cooled, significantly increasing their ripple current…read more
Thermal Paper Draws Top Award at PCIM Conference
May 10th, 2010
A paper on thermal aspects in power systems won a Young Engineer Award at this year’s PCIM (Power Electronics/Intelligent Motion/Power Quality) Europe Conference. The Young Engineer Award is presented to exceptional contributions from young professionals…read more
Study: Carbon Nanotubes Could be Used for New Energy Systems
May 10th, 2010
A team of scientists at Massachusetts Institute of Technology have discovered a previously unknown phenomenon that can cause powerful waves of energy to shoot through minuscule wires known as carbon nanotubes. The discovery could lead…read more
Health Assessment and Prognostics of Electronic Products: An Alternative to Traditional Reliability Prediction Methods
May 9th, 2009
Introduction Traditional handbook-based reliability prediction methods for electronic products include Mil-Hdbk-217, Telcordia SR-332 (formerly Bellcore), PRISM, FIDES, CNET/RDF (European), and the Chinese GJB-299. These methods rely on analysis of failure data collected from the field…read more
LED Thermal Standardization: A Hot Topic
May 9th, 2009
Introduction The main topic of the article is how to cope with the increasing need for standardization of thermal characterization of LEDs (Light Emitting Diodes) and LED-based products (see Fig.1 showing a typical LED package).…read more
Numerical Simulation of Complex Submicron Devices
May 1st, 2009
Introduction Significant increases in temperature are believed to contribute to losses in reliability and performance, and can present serious complications to thermal management. The net thermal effect depends on a combination of factors related to…read more
en Route to a Greener Thermal Technology
February 1st, 2008
It’s no surprise. Power levels in the data center keep rising. In fact, the cost of powering the computers in the data center is beginning to exceed the cost of the computers themselves. The computer…read more
Cooling Options And Challenges Of High Power Semiconductor Modules
November 1st, 2006
Introduction Trends in power electronics systems and devices over the last decade have placed increasing demands on the efficiencies of the thermal management systems used for power Metal Oxide Semiconductor Field-Effect Transistor (MOSFET) and Insulated…read more
Communication Network Power Efficiency Assessment, Limitations and Directions
August 1st, 2004
Introduction Despite the slowdown in the communication industry, Internet traffic continues to grow rapidly, fueled by the explosion in data communications, mobile Internet, e-commerce, content rich applications, and multi-media services. Internet traffic has increased by…read more
Critical Cooling Issues in High Power Radio Frequency Transmitter Amplifiers
May 1st, 2004
Introduction While emerging methodologies correctly insist that thermal engineers should be involved right from the early conceptual stages of electronics product design [1], many situations still require thermal analysis well after the introduction of the…read more
A Few Design Techniques On How To Reduce The Power
February 1st, 2003
There will always be the need to get heat out of high power circuitry, but with a little extra design effort up front, we may be able to reduce overall power needs. Here are two…read more
Numerical Modeling and Experimental Verification of High-density Servers
November 1st, 2002
High-density hardware and software are developed as part of an initiative to greatly increase data center compute densities. Concept systems presented here are based on the Intel® Itanium™ processor family and are designed for a…read more
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