Power

One-Component TIMs Suit Aerospace, Automotive and Semiconductor Industries

August 7th, 2014

Techsil now offers two new one-component thermal interface materials suitable for heat management in a variety of industries, including aerospace, automotive, medical, semiconductor and power. TIM11021 is a one-part grey paste silicone non-curing compound that…read more

Silica Additive Helps Solar Cells Cool Themselves

July 25th, 2014

Researchers at Stanford University in California may have overcome a major obstacle in the development of efficient, long-lasting solar cells with a silica additive designed to help the cells cool themselves.  Solar cells, which convert…read more

Phase-Change TIM Offers Good Alternative to Grease

July 7th, 2014

Universal Science has introduced a new phase change thermal interface material that offers a cleaner, more effective alternative to thermal grease. With 4.0 w/mK thermal conductivity, UniPhase 4000-COB is ideal for use in a wide…read more

Rugged Circuit Functions at Temperatures Greater than 350 Degrees Celsius

June 13th, 2014

Researchers at the University of Arkansas have developed integrated circuits capable of surviving at temperatures greater than 350 degrees Celsius, or approximately 660 degrees Fahrenheit. Created using silicon carbide, a semiconducting material that is more…read more

Syringe-Packaged Greases Satisfy Electrical and Thermal Conductivity Needs

June 9th, 2014

Intertronics now offers CircuitWorks’ syringe-packaged conductive greases, which provide electric and/or thermal conductivity for a range of applications. CircuitWorks’ new silicone-free heat sink grease will not harden or dry out while offering excellent thermal conductivity…read more

New Plastic Helps Prevent Phones from Overheating

May 21st, 2014

A new plastic material could significantly reduce problems associated with overheating mobile phones, say researchers from Loughborough University in England. Known as ultra-high molecular-weight polyethylene (UHMWPE), the new plastic, unlike the ones currently used in…read more

Liquid Cold Plate Cools Power Electronics

March 27th, 2014

Thermal management company GCoreLab has introduced a new generation of cold plates for the cooling of power electronics. The new XtremeChill liquid cold plate utilizes GCoreLab’s patented oblique fin technology, which offers superior thermal cooling…read more

Nanoscale Pillars May Improve Thermoelectric Materials

March 10th, 2014

Researchers at the University of Colorado Boulder say a new method of improving thermoelectric materials could lead to the development of better solar panels, more energy-efficient cooling equipment and effective devices that could turn waste…read more

Thermal Pad Offers Advantages of Thermal Grease Without Mess

March 3rd, 2014

AOS Thermal Compounds has released Micro-Faze, a new thermal interface material formulated with non-silicone thermal grease. Micro-Faze offers a number of technical advantages, including low thermal resistance with minimum force and conformance with coefficient of…read more

Thermoelectrically-Cooled Electronic Enclosure Line Expanded for More Applications

February 24th, 2014

EIC Solutions, a manufacturer of thermoelectric air conditioners, electronic enclosures and transit cases, has expanded its line of pre-packaged electronic enclosures with new sizes to meet more applications. Designed to protect and cool electronics and…read more

Electrical Field Facilitates Better Heat Transfer

January 9th, 2014

The application of an electric field to a condenser could double the efficiency of surface heat transfer in power plant and high performance computing cooling systems, according to new research released by scientists at MIT.…read more

New Fan Delivers High Static Pressure and Energy Reduction

December 16th, 2013

Sanyo Denki Co., Ltd. has introduced the new San Ace 92 DC fan to its DC fan lineup. Measuring 92 × 92 × 38 mm, the new fan delivers the industry’s highest static pressure and…read more

Thermoelectric Coolers for High Temperature Environments

November 22nd, 2013

Thermoelectric air conditioner supplier EIC Solutions has expanded its line of ThermoTEC thermoelectric coolers with the addition of a high ambient temperature model. Designed to cool electronic enclosures in extremely hot settings such as in…read more

New Surfaces Ease Dissipation of Extreme Heat

November 11th, 2013

A new method of cooling extremely hot surfaces more effectively from researchers at MIT could benefit industrial equipment and electronic devices. Considered by many to be a quieter, more efficient way of removing heat compared…read more