Power

New Approach to Simulate Nanoscale Thermoelectric Materials

April 18th, 2016

(April 7th, 2016) A research group led by Joe Feser, assistant professor in the Department of Mechanical Engineering at the University of Delaware, has developed a new approach to simulating nanoscale heat transfer in materials,…read more

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Application of Diamond Heat Spreaders for the Thermal Management of GaN Devices

April 14th, 2016

Application of Diamond Heat Spreaders for the Thermal Management of GaN Devices Thomas Obeloer*, Bruce Bolliger Element Six Technologies 3901 Burton Drive, Santa Clara, CA 95054 *thomas.obeloer@e6.com   Yong Han, Boon Long Lau, Gongyue Tang,…read more

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New Power Electronics Will Allow Army Vehicles’ Electronics to Operate at High Temperatures

April 4th, 2016

The US Army has awarded GE Aviation with a contract to develop silicon carbide-based power electronics that will allow high-voltage, next-generation ground vehicles to operate at higher temperatures. “The US Army’s implementation of [this technology…read more

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Overheating Causes 911 System Failure

April 4th, 2016

Due to a problem with the computer cooling system, 911 service was down for about four hours recently in Buffalo, New York’s Erie County. According to Time Warner Cable News, the room at the Public…read more

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New Coolers for Laser Diodes Released

March 29th, 2016

Recently Rogers Corporation’s Power Electronics Solutions (PES) group has released its new curamik CoolPerformance Plus coolers. Roger’s said that “curamik CoolPerformance Plus is an advanced liquid-cooled material designed to dissipate large amounts of heat and…read more

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Diamonds May Take Silicon’s Place in Future Smartphones

March 28th, 2016

A startup called Akhan Semi suggests lab-grown diamonds can cool electronics more efficiently than silicon. Silicon costs a lot to keep cool, but lab-grown diamonds could eliminate cooling fans and heat sinks since they already…read more

Posted in Blowers / Fans / Filters, Communications, Computer, Consumer, Design, Design, Heat Sinks, News, Power, Research, Semiconductor | Comments Off on Diamonds May Take Silicon’s Place in Future Smartphones

New Particle Creates Less Heat, Saves Energy

March 28th, 2016

Researchers have discovered a new particle that doesn’t consume a lot of energy, and thus doesn’t require an elaborate cooling system. It is called the Weyl fermion, a particle that only exists inside materials and…read more

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Registration for Thermal Conference Opens

March 21st, 2016

ITherm 2016 has now opened registration for the conference running from May 31 to June 3, 2016 at the Cosmopolitan Hotel in Las Vegas, Nevada. ITherm 2016 is the leading international conference for scientific and…read more

Cooling High-Powered Electronics with Tiny Drops of Water

March 21st, 2016

Lockheed Martin and the Defense Advanced Research Projects Agency (DARPA) Microsystems Technology Office (MTO) want to cool high-powered microchips with microscopic drops of water. “A core team of Lockheed Martin engineers is working on a…read more

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New Smartphone to Use Heat Pipe Cooling

March 1st, 2016

Samsung has declared that the new Galaxy S7 will use heat pipes for its cooling system. Smartphones typically lack ventilation holes and fans, so smartphone companies are moving to adopt heat pipes “because the technology…read more

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Scientists Grow Efficient Light-Emitting Organic Semiconductor Crystals

February 19th, 2016

Recently, scientists from the faculty of physics of the Moscow State University have grown organic semiconductor crystals with extremely high light-emitting efficiency that can reduce the cost of creating light, flexible, and transparent light-emitting electronic…read more

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Computing Hardware Overclocks to 7GHz Using Liquid Nitrogen

February 15th, 2016

A man from Hong Kong broke the speed record for his Intel Skylake by overclocking to 7.025 GHz clock speed with liquid nitrogen cooling, as reported by DigitalTrends.com. To achieve this 75 percent boost, “the…read more

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Nominations Open for IEEE ITherm Achievement Award

February 8th, 2016

The biennial ITherm Achievement Award is open for nominations for 2016. The Award is presented in recognition of significant contributions made in thermal and thermomechanical management of electronics, of pioneering and sustaining electronics thermal/thermomechanical research…read more

University Joins Research Project to Develop Heat-resistant Electrical Systems for Vehicles

August 11th, 2015

The University of Arkansas announces it will help lead an $18.5 million dollar engineering research center to develop new electrical systems for vehicles that are more powerful, efficient and heat-resistant. The university houses a 7,000-square-foot…read more

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