Polyonics has designed an ultra-thin, white coated, polyimide label material that uses a 0.5 mil film for space constrained electronics. The XF-616 is a high temperature, thermal transfer printable material with an aggressive acrylic adhesive…read more
Thin Label Material Made of 0.5 Mil Polyimide Film
March 9th, 2012
Posted in Materials, Compounds, Adhesives, Substrates, New Products | No Comments »
New Flat Wire Inductors Excel At High Temperatures
June 28th, 2011
Datatronics’ new DR79892 and DR 79893 Flat Wire Inductors feature a flat wire design that is coiled and mounted directly to the circuit board to allow efficient heat dissipation. These inductors are designed for performance…read more
Posted in Industrial, New Products | No Comments »
Thermal Facts and Fairy Tales: Uncertainty is Assured
July 26th, 2010
Do you know the thermal conductivity of paper? This was the start of a phone call a few years ago. The conversation continued and the reason for the question became apparent. A thermal analysis of…read more
Posted in Applications, Design, Materials, Compounds, Adhesives, Substrates | No Comments »
Modeling Heat Conduction in Printed Circuit Boards Using Finite Element Analysis
May 1st, 2004
Introduction Heat transfer in and around a printed circuit board (PCB) is generally very complex. Some of the heat generated in components is conducted away through the multiple conducting (trace) layers, vias, and dielectric layers…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Test & Measurement | No Comments »
Convection and radiation heat loss from a printed circuit board
September 1st, 1998
In last issue’s column, a method for calculating the thermal conductivity of a printed circuit board (PCB) was described. Now, we look at a more complicated heat transfer process, namely the loss of heat from…read more
Posted in Calculation Corner, Design, Test & Measurement | No Comments »
Electronic package characterization per JEDEC standard
January 1st, 1996
Introduction With the increase in power density resulting from advancements insemiconductor packaging technologies comes the issue of heat dissipation. Heatis generated as a result of electrical energy being converted to thermal energyduring circuit activities. The…read more
Posted in Design, Software, Test & Measurement | No Comments »
Recent Posts
- Measured Thermal Resistance of Microbumps in 3D Chip Stacks
- Measuring and Predicting Junction Temperature: Thermal Factors Influencing Reliability in GaN HEMTs
- APEC 2013: Applied Power Electronics Conference and Exhibition
- Acquisition of R.O.C. Fan Design and Manufacturing Company Adds New Blowers and Fans to Global Thermal Management Product Line
- Modular Cooling System Designed for Rapid Deployment with Containerized Data Centers
- Modular Aisle Containment Solution Separates Hot and Cold Airflows in Energy-Efficient Manner
- New Metal Oxide-Silicone Thermal Compound Offers Thermal Conductivity of 7.5W/mK
- New Customizable Heat Sinks for Use in High Power Environments and Resistors
Latest Issue
Don’t miss out on
the March 2013 issue
of Electronics Cooling, which includes feature articles on the Benefits and Drawbacks of Using Two-Phase Cooling Technologies in Military platforms, Measured Thermal Resistance of Microbumps in 3D Chip Stack, and more.
View Issue »
Popular Posts
- Simplified Formula for Estimating Natural Convection Heat Transfer Coefficient on a Flat Plate 2 comment(s)
- The Seebeck Coefficient 3 comment(s)
- The Thermal Conductivity of Moist Air 5 comment(s)
- Advances In High-Performance Cooling For Electronics 11 comment(s)
- Heat pipes for electronics cooling applications 8 comment(s)
- Notes on Using Thermocouples 9 comment(s)
- Estimating Parallel Plate-Fin Heat Sink Thermal Resistance 9 comment(s)
- Thermal Conductivity of Solders 2 comment(s)
