Posts tagged Copper

Bristly Particles Could Manage Heat Flow in Electronics

October 25th, 2011

A well-known method of making heat sinks for electronic devices is a process called sintering, in which powdered metal is formed into a desired shape and then heated in a vacuum to bind the particles…read more

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Low Resistance Connector with Silicone Core

June 13th, 2011

Fujipoly’s Zebra® Gold 8000C Series product is constructed from a low durometer silicone core that is covered with 166 parallel rows of flat, gold-plated wires per inch. This construction allows the connector to accommodate PCBs…read more

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Multiple Platforms CPU Cooler

May 25th, 2010

GlacialTech has introduced the IGLOO 5760 Multiple Platforms CPU cooler. This design incorporates a specially aligned copper heat pipe combination of three pipes that disperse the heat from the CPU directly into the heat sink…read more

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Researchers Cool Down Supercomputers with Warm Water

April 27th, 2010

A team of IBM researchers in Switzerland is experimenting with a micro network of copper tubes that run through smaller, clustered computer servers and whisk away heat with the help of warm water. Liquid cooling,…read more

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Thermal Resistance Comparison Of Graphite Foam, Aluminum, And Copper Heat Sinks

February 1st, 2006

Introduction With thermal solutions becoming more challenging, there is a push for novel cooling ideas or materials to further mitigate thermal issues facing today’s electronics. In these design situations, the proven method of analytical calculations,…read more

Posted in Aerospace, Design, Heat Sinks, Materials, Compounds, Adhesives, Substrates, Technical Brief, Test & Measurement | Comments Off

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Graphite fiber reinforced al and cu alloys for thermal management applications

January 1st, 1999

Technological advances in the electronics industry have revolutionized the way the world communicates and conducts business. Today’s electronic products, from cellular phones to sophisticated imaging satellites, demand lightweight, low-cost materials that provide more functionality in…read more

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