A well-known method of making heat sinks for electronic devices is a process called sintering, in which powdered metal is formed into a desired shape and then heated in a vacuum to bind the particles…read more
Bristly Particles Could Manage Heat Flow in Electronics
October 25th, 2011
Posted in Heat Sinks, News | No Comments »
Low Resistance Connector with Silicone Core
June 13th, 2011
Fujipoly’s Zebra® Gold 8000C Series product is constructed from a low durometer silicone core that is covered with 166 parallel rows of flat, gold-plated wires per inch. This construction allows the connector to accommodate PCBs…read more
Posted in Consumer, New Products | No Comments »
Multiple Platforms CPU Cooler
May 25th, 2010
GlacialTech has introduced the IGLOO 5760 Multiple Platforms CPU cooler. This design incorporates a specially aligned copper heat pipe combination of three pipes that disperse the heat from the CPU directly into the heat sink…read more
Posted in Applications, Blowers / Fans / Filters, Computer, Coolers, Heat Sinks, Industries, New Products | No Comments »
Researchers Cool Down Supercomputers with Warm Water
April 27th, 2010
A team of IBM researchers in Switzerland is experimenting with a micro network of copper tubes that run through smaller, clustered computer servers and whisk away heat with the help of warm water. Liquid cooling,…read more
Posted in Applications, Computer, Industries, Liquid Cooling, News | 1 Comment »
Thermal Resistance Comparison Of Graphite Foam, Aluminum, And Copper Heat Sinks
February 1st, 2006
Introduction With thermal solutions becoming more challenging, there is a push for novel cooling ideas or materials to further mitigate thermal issues facing today’s electronics. In these design situations, the proven method of analytical calculations,…read more
Posted in Aerospace, Design, Heat Sinks, Materials, Compounds, Adhesives, Substrates, Technical Brief, Test & Measurement | No Comments »
Graphite fiber reinforced al and cu alloys for thermal management applications
January 1st, 1999
Technological advances in the electronics industry have revolutionized the way the world communicates and conducts business. Today’s electronic products, from cellular phones to sophisticated imaging satellites, demand lightweight, low-cost materials that provide more functionality in…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Technical Brief | No Comments »
Recent Posts
- Research Company Names Top Thermal Management Supplier
- Thin-Film Thermoelectrics with Improved Cooling Efficiency
- Temperature/Process Controller Panel CNI-CB120SB
- New Version of Software for Modeling Data Centers
- New Data Center Infrastructure Management Software
- Thermocouple Virtual Chart Recorder
- Company Sets World Record for Solar Module Efficiency
- Cooling Semiconductor with Laser Light
Latest Issue
Don’t miss out on
the December 2011 issue
of ElectronicsCooling, which includes feature articles on data center design, electro-thermal simulation of power, energy reduction and performance maximization.
View Issue »
Most Popular Posts
- The Thermal Conductivity of Moist Air 4 comment(s)
- The Seebeck Coefficient 2 comment(s)
- Heat pipes for electronics cooling applications 6 comment(s)
- Notes on using thermocouples 4 comment(s)
- Advances In High-Performance Cooling For Electronics 11 comment(s)
- Simplified Formula for Estimating Natural Convection Heat Transfer Coefficient on a Flat Plate 0 comment(s)
- All you need to know about fans 1 comment(s)
- Estimating Parallel Plate-Fin Heat Sink Thermal Resistance 1 comment(s)
- @ztechsales Thanks for tweeting our article! We have added you to our follower list. If you like, feel free to add us! #
- Molten metal ceramic sheath thermocouple - read more - http://t.co/b0UmtWy7 #
- Look for the special TIMs issue of the newsletter next week! Subscribe today to get your copy - http://t.co/g5vHe7TA #
- Read about a 40 GHz bandwidth socket for 16x16mm, 0.8mm pitch packages - http://t.co/2HUoSENS #
