When Pittsburgh Materials Technology, Inc. (PMTI) owners Joseph and JoAnn Giglio decided to sell their specialty materials technology business after 17 years of operations, they said finding the right buyer was more important than finding…read more
Thermacore Acquires Pittsburgh Materials Technology, Inc.
June 21st, 2010
Posted in Design, News | No Comments »
Energy Efficiency Reshapes Thermal Management Challenges
June 21st, 2010
Electronic equipment manufacturers are increasingly more focused on achieving high efficiency levels for their circuit designs in response to global concerns about the impact on the environment. However, the thermal benefits of high efficiency circuit…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, News | No Comments »
Solid State Lighting Connector
June 7th, 2010
New from Tyco Electronics is an IDC solid state lighting (SSL) connector for quick, tool-less termination of discrete wires onto LED printed circuit boards (PCBs). The product terminates 18 through 24 AWG solid and stranded…read more
Posted in Applications, Design, Industries, LED / Lighting, New Products | No Comments »
Thermal/EMI Combination Shield Design Case Study
May 10th, 2010
Laird Technologies, Inc. recently released its thermal/EMI combination shield design case study, which discusses in detail the process of how thermal simulation software was utilized in the design of a thermal/EMI combination shield. Instead of…read more
Posted in Applications, News, Software | No Comments »
Software Tool Available for Simulating Cooling Performance of Data Center
April 12th, 2010
Innovative Research, Inc. recently released TileFlow 4.2, a new version of its three-dimensional software tool for simulating cooling performance of data center. TileFlow now allows users to include upflow CRAC units in the data center…read more
Posted in Applications, Data Centers, Industries, New Products, Software | No Comments »
Textbook covers basic heat transfer theory, practical guidelines
April 6th, 2010
“Heat Transfer: Thermal Management of Electronics,” a reference and textbook by Dr. Younes Shabany, includes both basic heat transfer theory as well as practical guidelines for solving thermal design problems that are common to electronic…read more
Posted in Applications, Design, New Products | No Comments »
Design and reliability considerations in avionics electronics packaging
September 1st, 1999
In the avionics industry, regulatory agencies and standards organizations, such as Federal Aviation Regulation (FAR) [1], Aeronautical Radio, Inc. (ARINC) [2], and Radio Technical Commission for Aeronautics (RTCA) [3], have developed sets of test procedures…read more
Posted in Aerospace, Defense, Design, Test & Measurement | No Comments »
Recent Posts
- Measured Thermal Resistance of Microbumps in 3D Chip Stacks
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- Modular Cooling System Designed for Rapid Deployment with Containerized Data Centers
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- New Metal Oxide-Silicone Thermal Compound Offers Thermal Conductivity of 7.5W/mK
- New Customizable Heat Sinks for Use in High Power Environments and Resistors
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