Laird Technologies, Inc. recently released its thermal/EMI combination shield design case study, which discusses in detail the process of how thermal simulation software was utilized in the design of a thermal/EMI combination shield. Instead of building a physical prototype, the initial concept design was simulated, allowing for an accurate prediction of the thermal performance of the initial and subsequent designs without having to actually build and test a prototype.
The case study is available free for download from Laird.
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Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
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