Introduction It comes as no surprise to anyone in our industry that device power levels are increasing to support customer expectations of ever greater functionality and performance. The greatest thermal challenges in computing occur in…read more
Packaging Challenges For High Heat Flux Devices
August 1st, 2006
Posted in Design, Materials, Compounds, Adhesives, Substrates, Semiconductor, Test & Measurement, TIMs | No Comments »
Parameters affecting package thermal performance a low end system level example
May 1st, 2001
Thermal management of electronic equipment is a dynamic process. For example, the anticipated power trends for CMOS technology can be found in the roadmaps of [1 and 2]. They closely follow the rapidly rising power…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Semiconductor, Test & Measurement | No Comments »
Improving productivity in electronic packaging with flow network modeling (fnm)
January 1st, 1999
As the complexity and power density of electronics systems increase, so too does the demand for tools to improve both product quality and designer productivity. This is especially true for thermal designers who use Computational…read more
Posted in Blowers / Fans / Filters, Coolers, Heat Sinks, Liquid Cooling, Semiconductor, Test & Measurement | No Comments »
Thermal testing and control by means of built-in temperature sensors
September 1st, 1998
Introduction This paper will discuss a new approach to the measurement of the thermal properties of PCBs and the packages mounted to them. It is intended to replace traditional solutions, such as using thermocouples and…read more
Posted in Blowers / Fans / Filters, Design, Heat Sinks, Materials, Compounds, Adhesives, Substrates, Test & Measurement | No Comments »
Thermal interface under a plastic quad flat pack
May 1st, 1998
Introduction Plastic components are designed so that the heat is dissipated by forced or natural convection. The use of plastic packages under conditions where neither cooling method is available introduces new challenges. High heat-dissipation plastic…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Plastics, Test & Measurement, TIMs | No Comments »
Packaging: designing for thermal performance
May 1st, 1997
Figure 1. Various leadframe and BGA packages Introduction The well-established trend within the electronics industry to provide everincreasing computing power at less cost seems to defy the laws of economics.However, this industry has not been…read more
Posted in Design | No Comments »
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