CUI Inc is adding a 600 W device to the company’s line of rugged chassis mount DC-DC converters. The VFK600 series measures 7.8 x 5.0 x 1.5 inch and includes an integrated heat sink for…read more
600-W DC-DC Converter with Integrated Heat Sink
January 9th, 2012
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Heat Sinks Feature Improved Tower Fin and Heat Pipe Layout
October 11th, 2011
Cooler Master’s Hyper 212 EVO and Hyper TX3 EVO CPU Coolers have an improved tower fin design, heat pipe layout, upgraded fans and fan brackets. All of which provides an even more extreme value for…read more
Posted in Blowers / Fans / Filters, Heat Sinks, New Products | No Comments »
Solar-Powered Lasers Use Heat Sink for Cooling
October 11th, 2011
A researcher in Uzbekistan has proposed a plan for solar-powered lasers using small parabolic mirrors about 3 feet in diameter, combined with new two-layer ceramic disks to produce laser light. When sunlight hits the ceramic…read more
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Optimal Thermal Management Performance Solution
August 22nd, 2011
Newark has established an exclusive stocking agreement for Wakefield Solutions’ new LED heat sink extrusions. Wakefield and Bridgelux engineering teams worked together at Newark’s behest to design an optimal heat sink extrusion line which is…read more
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New Air-Cooling Technology Reduces Energy Use
July 11th, 2011
Sandia National Laboratories has developed a proprietary air-cooling invention, the “Sandia Cooler,” also known as the “Air Bearing Heat Exchanger.” The Sandia Cooler technology, which is patent-pending, will significantly reduce the energy needed to cool…read more
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Honeycomb Heat Sink Utilizes Science of Real Honey Bees
June 13th, 2011
Utilizing the science of real honey bees, JaroThermal’s newest Honeycomb heat sink directs heat towards the outside, while producing a steady flow of cool air on the inside. A multi-holed design and increased surface area…read more
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Thermally Conductive Grease Used for Solar Industry
May 10th, 2011
A product that is proving useful to the solar industry is LORD Corporation’s TC-501 Thermally Conductive Grease. This solvent-free, silicone thermal interface material (TIM) is designed to replace greases used as TIMs between the heat…read more
Posted in New Products, TIMs | No Comments »
Niagara Thermal Products Acquires Thermshield
March 23rd, 2011
Niagara Thermal Products LLC’s acquisition of Thermshield, LLC brings together two companies in the design and supply of custom thermal solutions across a wide range of markets and applications. Niagara Thermal and Thermshield will continue…read more
Posted in Applications, Heat Sinks, News | No Comments »
Thermal Company Partners With Packaging Services Firm
February 4th, 2011
Thermal Engineering Associates (TEA) is partnering with engineering services firm, Package Science Services (PSS) to provide measurement, modeling and simulation of IC packages for a number of its customers. The pooling of TEA and PSS…read more
Posted in Heat Sinks, News, TIMs | No Comments »
DoD Extends Contract for Heat Sink Technology
February 4th, 2011
Thermacore was awarded a $3 million Option Phase contract extension by the Defense Advanced Research Projects Agency (DARPA) to continue the development and commercialization of active heat sink technologies for Micro-technologies for Air-Cooled Exchangers (MACE).…read more
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Laser Cooling Systems Offer Heatsink Module
January 25th, 2011
Elite Thermal Engineering (ETE) introduces turnkey cooling systems for fiber coupled laser diodes produced by LIMO, Jenoptik, QPC and nLight. The cooling systems can also be customized for fiber coupled laser diodes manufactured by other…read more
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New Snap-in Aluminum Electrolytic Capacitors
December 27th, 2010
TDK-EPC, a group company of TDK Corporation, has developed snap-in aluminum electrolytic capacitors from EPCOS that enable optimal contact to heat sinks. This permits link circuit capacitors to be efficiently cooled, significantly increasing their ripple current…read more
Posted in Industries, New Products, Power | No Comments »
ElectronicsCooling Winter 2010 Issue
December 6th, 2010
Don’t miss out on the Winter 2010 issue of ElectronicsCooling, which includes a sneak peek at SEMI-THERM 27, feature articles on open bath immersion cooling, and energy consumption of data centers, as well as technical…read more
Posted in Calculation Corner, Data Centers, Editorial, Heat Sinks, Liquid Cooling, Technical Brief, Technical Data | 1 Comment »
Calculation Corner: Thermal Interactions Between High-Power Packages and Heat Sinks, Part 1
December 6th, 2010
Bruce Guenin, PhD Associate Technical Editor The need to accommodate increasing chip power has led to improved package and heat sink designs having much lower thermal resistance values than previously. This has led to challenges…read more
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