The partners in a new EU-funded research project recently announced details of the multinational/multidisciplinary program: “THERMINATOR: Modeling, Control and Management of Thermal Effects in Electronic Circuits of the Future.” This three-year project is designed to…read more
THERMINATOR Project Warms Efforts to Cool Semiconductor Design Solutions
April 12th, 2010
Posted in Applications, News, Semiconductor | No Comments »
Modeling Multiple Heat Source Problems In Electronic Systems
May 1st, 2008
Introduction Readers of ElectronicsCooling know about the rapid pace of technological developments towards an increasingly higher level of miniaturization and, hence, an incredible increase of dissipation power densities. Thus, restating some very well known facts…read more
Posted in Design, Test & Measurement | No Comments »
Providing More Value Than Playing Video Games
November 1st, 2007
ElectronicsCooling magazine was founded more than 12 years ago with a mission of providing current and practical thermal management information with archival value. I hope you agree this magazine is still delivering on its original…read more
Posted in Design, Editorial | No Comments »
Using an Equivalent Heat Transfer Coefficient to Model Fins on a Fin
May 1st, 2005
Many readers of ElectronicsCooling are probably familiar with the use of fin efficiency formulas to estimate the thermal resistance of the commonly used parallel plate fin heat sink. Given the heat transfer coefficient, h, acting…read more
Posted in Calculation Corner, Design, Heat Sinks, Test & Measurement | No Comments »
Natural convection modeling of heat sinks using web-based tools
September 1st, 2000
Heat transfer in electronic packages is a complex problem involving a network of resistive paths for the various laminated structures, bonding adhesives, lead frames, and attachment mechanisms, such as ball grid arrays. However, despite the…read more
Posted in Design, Heat Pipes, Software, Test & Measurement | No Comments »
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