Posts tagged Numerical Modeling

Request For Proposals By The Toyota Research Institute of North America

November 6th, 2015

      The Toyota Research Institute of North America (TRINA), Electronics Research Department (ERD), is seeking research proposals on two technical topics. Application can be found below   TRINA, established in 2008, is a…read more

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Numerical Modeling and Experimental Verification of High-density Servers

November 1st, 2002

High-density hardware and software are developed as part of an initiative to greatly increase data center compute densities. Concept systems presented here are based on the Intel® Itanium™ processor family and are designed for a…read more

Posted in Blowers / Fans / Filters, Computer, Design, Heat Sinks, IT Products, Power, Semiconductor, Test & Measurement | Comments Off on Numerical Modeling and Experimental Verification of High-density Servers

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High accuracy thermal interface resistance measurement using a transient method

September 1st, 2000

Heat dissipation of active devices has become one of the limiting factors in further miniaturization. While component manufacturers succeed in decreasing the overall thermal resistance of their packages, the thermal interface resistance to the board…read more

Posted in Design, Materials, Compounds, Adhesives, Substrates, Test & Measurement | Comments Off on High accuracy thermal interface resistance measurement using a transient method

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