Ironwood Electronics’ new high performance BGA socket product line uses elastomer capable of high speed, low inductance, high endurance and wide temperature applications. The SM-BGA-9006 socket is designed for 16X16 mm package size and operates at…read more
40 GHz Bandwidth Socket for 16x16mm, 0.8mm Pitch BGA Packages
January 17th, 2012
Posted in New Products, Test & Measurement | No Comments »
Low Resistance Connector with Silicone Core
June 13th, 2011
Fujipoly’s Zebra® Gold 8000C Series product is constructed from a low durometer silicone core that is covered with 166 parallel rows of flat, gold-plated wires per inch. This construction allows the connector to accommodate PCBs…read more
Posted in Consumer, New Products | No Comments »
creating PCB thermal conductivity maps using image processing
September 13th, 2010
Byron Blackmore Mentor Graphics Corporation Introduction Thermal conduction into a printed circuit board (PCB) is often an important part of the critical heat transfer path in electronic devices. Efficiently capturing the effect of the heterogeneous…read more
Posted in | 1 Comment »
Embedded Wafer-Level-Packages
August 10th, 2010
Yole Developpement has released its new report on Embedded Wafer-Level-Packaging. This analysis covers both Fan-Out WLP technology development and Chip embedding into PCB laminated substrates. These two infrastructures are emerging at the same time and ramping to…read more
Posted in New Products, News | No Comments »
New Instrument System Enables Precise Air Flow
July 26th, 2010
Advanced Thermal Solutions, Inc. (ATS) has introduced the iTHERM-100 Test Station, a turnkey system of laboratory instruments and sensors for studies that require precise air flow velocity and temperature measurement. Applications include thermal management studies…read more
Posted in New Products, Test & Measurement | No Comments »
Solid State Lighting Connector
June 7th, 2010
New from Tyco Electronics is an IDC solid state lighting (SSL) connector for quick, tool-less termination of discrete wires onto LED printed circuit boards (PCBs). The product terminates 18 through 24 AWG solid and stranded…read more
Posted in Applications, Design, Industries, LED / Lighting, New Products | No Comments »
Thermal Paper Draws Top Award at PCIM Conference
May 10th, 2010
A paper on thermal aspects in power systems won a Young Engineer Award at this year’s PCIM (Power Electronics/Intelligent Motion/Power Quality) Europe Conference. The Young Engineer Award is presented to exceptional contributions from young professionals…read more
Posted in Applications, Industries, Liquid Cooling, News, Power | No Comments »
thermal facts and fairy tales: most of us live neither in wind tunnels nor in the world of Nusselt
April 30th, 2010
Having read myriad papers/articles/books/reports on thermal management, I feel there is a lot of misunderstanding about what really should drive a sound approach of how to tackle the thermal problems that tend to land on…read more
Posted in Applications, Liquid Cooling | No Comments »
New heat sink series provide secure attachment with minimum of board real estate
April 6th, 2010
Alpha’s series of heat sinks feature an innovative attachment mechanism. Electronic components have become faster and more compact, generating more heat and increasing thermal densities. This has led to the use of heat sinks of…read more
Posted in Applications, Heat Sinks, New Products | 1 Comment »
Modeling Heat Conduction in Printed Circuit Boards Using Finite Element Analysis
May 1st, 2004
Introduction Heat transfer in and around a printed circuit board (PCB) is generally very complex. Some of the heat generated in components is conducted away through the multiple conducting (trace) layers, vias, and dielectric layers…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Test & Measurement | No Comments »
Characterizing a package on a populated printed circuit board
May 1st, 2001
This column has emphasized methods of analyzing packages in the JEDEC-standard test environment. A thermal metric that lends itself to analyses of system applications is the junction-to-board thermal characterization parameter, JB. If one knows the…read more
Posted in Calculation Corner, Design, Materials, Compounds, Adhesives, Substrates, Test & Measurement | No Comments »
Parameters affecting package thermal performance a low end system level example
May 1st, 2001
Thermal management of electronic equipment is a dynamic process. For example, the anticipated power trends for CMOS technology can be found in the roadmaps of [1 and 2]. They closely follow the rapidly rising power…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Semiconductor, Test & Measurement | No Comments »
Visualization of air flows in electronics systems
May 1st, 2001
The three-dimensional shape and irregular nature of electronic component topologies on air-cooled Printed Circuit Boards (PCBs) give rise to complex air flow patterns that have been well documented [1]. Even laminar flows over relatively simple…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Test & Measurement | No Comments »
Adjusting temperatures for high altitude
September 1st, 1999
Many companies design products with electronics that must function reliably at high altitude, typically 1,500m (5,000 ft) or 3,000m (10,000 ft) above sea level. Estimating the increase in operating temperatures is necessary to design and…read more
Posted in Aerospace, Blowers / Fans / Filters, Design, Heat Sinks, Technical Brief, Test & Measurement | No Comments »
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