Scientists in GE’s Global Research Center have demonstrated an advanced thermal material system that could lead to faster computing and higher performing electronic systems. They have fabricated a prototype substrate that can cool electronic devices,…read more
Breakthrough Thermal Material System to Enable Faster Computing
March 18th, 2011
Posted in Computer, Materials, Compounds, Adhesives, Substrates | No Comments »
Heat of Vaporization
August 1st, 2008
Thermal energy transfer associated with a change of phase can be a valuable phenomenon for engineers designing systems for electronics cooling. Solid to liquid phase change materials were described in the May 2005 Technical Data…read more
Posted in Materials, Compounds, Adhesives, Substrates, Technical Data, Test & Measurement | No Comments »
Use Of Heat Pipe Cooling Systems In The Electronics Industry
November 1st, 2004
Introduction Thermal management of electronic components must solve problems connected with the limitations on the maximum chip temperature and with the requirements on the level of temperature uniformity. To cool electronic components, one can use…read more
Posted in Design, Heat Pipes, Heat Sinks, Test & Measurement | No Comments »
Test methods for characterizing the thermal transmission properties of phase-change thermal interface materials
May 1st, 1999
All phase change thermal interface materials are designed to minimize the thermal resistance in an interface between a heat generating component and a heat sink. How well they achieve this goal in a specific application…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Test & Measurement, TIMs | No Comments »
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