Posts tagged Thermal Conductivity

New Method for Enhancing Thermal Conductivity Could Cool Computer Chips

December 22nd, 2011

The surprising discovery of a new way to tune and enhance thermal conductivity gives engineers a new tool for managing thermal effects in smart phones and computers, lasers and a number of other powered devices.…read more

Posted in News, Test & Measurement | Comments Off

Tags: ,

Thermal Conductivity Test Board for Leaded Surface Mount Packages Standard

November 8th, 2011

This fixturing further defines the environment for thermal test of packaged microelectronic devices. Its function is to provide an alternate mounting surface for the analysis of heat flow in electronic components. The objective of the…read more

Posted in Standards | Comments Off

Tags: ,

Gap Filler Pad with Low-Tac Top Surface

October 11th, 2011

Fujipoly’s new Sarcon® 50G-Hm is a high performance, low resistance gap filler pad manufactured with a special low-tac top surface. The one-sided treatment is less sticky than the opposing surface allowing the thermal pad to…read more

Posted in New Products, TIMs | Comments Off

Tags: , ,

Fluoropolymer Composite and Liquid-Crystal-Polymer Laminates

September 27th, 2011

Rogers Corporation’s RT/duroid 6035HTC is a high-thermal-conductivity fluoropolymer composite that contains a unique filler system, enabling a thermal conductivity of 1.44 W/m/K while maintaining low drill wear. The thermally stable material has a z-axis dielectric constant…read more

Posted in Materials, Compounds, Adhesives, Substrates, New Products, TIMs | Comments Off

Tags: , ,

Gap Filler Has Thermal Conductivity of 1.6 W/m-k

August 5th, 2011

T-Global Technology Ltd’s new gap filler, L37-5S, has a Shore OO hardness of 3 and a thermal conductivity of 1.6 W/m-k. It is specifically aimed at consumer electronics and LED applications where optimum performance is…read more

Posted in Materials, Compounds, Adhesives, Substrates, New Products | Comments Off

Tags: , ,

Thermal Management PCBs Solve Thermal Problems for LED Industry

June 13th, 2011

SinkPAD Corporation’s new SinkPADTM aluminum PCB technology are a complete and effective solution to the challenges faced by the solid state lighting industry, specifically those with aluminum LED PCB applications. SinkPADTM conducts heat out of…read more

Posted in LED / Lighting, New Products | Comments Off

Tags: , , ,

Thermally Conductive Grease Used for Solar Industry

May 10th, 2011

A product that is proving useful to the solar industry is LORD Corporation’s TC-501 Thermally Conductive Grease. This solvent-free, silicone thermal interface material (TIM) is designed to replace greases used as TIMs between the heat…read more

Posted in New Products, TIMs | Comments Off

Tags: , , , , ,

Silicone Putty Thermal Interface Material

April 8th, 2011

Fujipoly’s Sarcon® XR-v-AL is a uniquely formulated silicone thermal interface material that offers the installation flexibility of a putty-like sheet. Sarcon® XR-v-AL provides a thermal conductivity of 6.0 W/m°K and thermal resistance of just .04…read more

Posted in New Products, TIMs | Comments Off

Tags: ,

New Grade of Thermal CVD Diamond Material

March 23rd, 2011

Element Six has announced the commercial availability of DIAFILM 200, a diamond thermal material that can offer users thermal conductivity in excess of 2000W/mK. This grade of CVD (chemical vapor deposition) diamond thermal material is…read more

Posted in Applications, Materials, Compounds, Adhesives, Substrates, New Products | Comments Off

Tags: , ,

Thermal Conductive Materials & EM Noise Absorbents

March 22nd, 2011

Taica’s Alpha Gel’s softness and conformity help minimize heat resistance and stress on critical devices in electronics. K thermal-conductivity material is available, facilitating heat dissipation results. The gel retains the softness and tackiness of its…read more

Posted in Applications, Materials, Compounds, Adhesives, Substrates, New Products | 1 Comment »

Tags: ,

Researchers Developing Silver-Diamond Thermal Shim

March 4th, 2011

Researchers at the Georgia Tech Research Institute are developing a solid composite material, made of silver and diamond to cool small, powerful microelectronics used in defense systems. The diamonds provide the bulk of thermal conductivity,…read more

Posted in Defense, Materials, Compounds, Adhesives, Substrates, News | Comments Off


Thermal Facts and Fairy Tales: Published Thermal Conductivities Values: Facts or Fairy Tales?

March 2nd, 2011

Around 1980, when I joined the Heat Transfer Group at Philips CFT, my boss threw a piece of material on my desk and asked for its thermal conductivity. It took me a week digging in…read more

Posted in | 1 Comment »


New Book on Thermal Computations for Electronics

February 21st, 2011

Thermal Computations for Electronics: Conductive, Radiative, and Convective Air Cooling by Gordon Ellison is a total revision of his previous work on the subject.  This text helps readers understand and master mathematical calculation, prediction and…read more

Posted in News | Comments Off


Cooling High-Power Electronic Components in Small Packages

September 14th, 2010

Thermacore’s Therma-Base vapor chamber is used as the base of a heat sink to alleviate spreading resistance  found in solid heat sink construction, which enables lower device temperature and greater component reliability. The chamber features…read more

Posted in Coolers, Heat Sinks, New Products | 1 Comment »

Tags: , ,