Electronic Cooling Solutions Inc (ECS) recently announced the opening of its Rocky Mountain office. Guy Wagner, a thermal management expert with over 35 years of experience, will be in charge of the new office. The…read more
Graphics Card with Thermal Design Offers Quiet Performance
February 4th, 2011
Graphics card and mainboard manufacturer MSI recently unveiled its N560GTX-Ti Twin Frozr II/OC graphics card featuring the Twin Frozr II Thermal Design. An appraisal by BenchmarkReviews.com determined that “the Twin Frozr II cooling system is…read more
Posted in Computer, New Products | No Comments »
Experimental Methodologies for Thermal Design in Silicon Validation Platforms
July 26th, 2010
Rahima K. Mohammed, Yi Xia, Ying-Feng Pang, Ridvan A. Sahan Intel® Corporation Introduction Silicon validation platforms are purpose-built to validate processors, chipsets, and ASICs to ensure world-class quality and reliable products. These platforms are a…read more
Posted in Computer, Materials, Compounds, Adhesives, Substrates | No Comments »
Solve Thermal Issues Earlier in Updated Board Designs
February 1st, 2005
Introduction Often new products or product concepts only introduce some new aspects and rely heavily on existing designs. At the board level this often means only one section of a board is retooled or upgraded;…read more
Posted in Computer, Design, Heat Sinks, Materials, Compounds, Adhesives, Substrates, Technical Brief | No Comments »
Effective Thermal Design for Electronic Systems
May 1st, 2003
In the past, the thermal designer’s role was seen as one of predicting temperatures and ensuring that reliability limits are met for products. However, the role of an effective thermal designer is much more than…read more
Posted in Design, Test & Measurement | No Comments »
Challenges In Thermal Control Of Military Electronics Systems
February 1st, 2003
Thermal design engineers working in defense electronics are facing many challenges, some of which have been around for a long time and some that are more recent. Worldwide climatic extreme temperatures are reasonably constant and…read more
Posted in Aerospace, Communications, Defense, Design, Test & Measurement | No Comments »
Thermal Design Challenges in Automotive Alternator Power Electronics
May 1st, 2002
Ever since the advent of the automotive alternator, or claw-pole alternating current generator, in the 1960′s, there has been an ever-increasing thermal design challenge to cool the power electronics in these machines. Figure 1 depicts…read more
Posted in Automotive, Design, Heat Sinks, Liquid Cooling, Power, Test & Measurement | 1 Comment »
Diamonds are a Thermal Designer’s Best Friends
February 1st, 2002
Different forms of carbon, such as processed natural graphite, pyrolytic graphite, diamond-like carbon, and synthetic diamond, offer lots of possibilities for maximizing conductive heat transfer.Synthetic diamond has already found its place as a common solution…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Technical Data, Test & Measurement | No Comments »
The increasing importance of thermal test dies
September 1st, 2000
Thermal test dies are among the major tools used in package thermal design qualification. They are usually simple chips, containing heaters and temperature sensors. The sensors measure the temperature on the chip surface as a…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Semiconductor, Test & Measurement | No Comments »
Ten stupid things engineers do to mess up their cooling
January 1st, 2000
Editor’s Note: On the eve of the new millenium, the editors of ElectronicsCooling have decided to depart from our normal serious tone just this once, unless, of course, we can convince Tony to contribute another…read more
Posted in Design | 1 Comment »
Recent Japanese thermal solutions for portable computers
September 1st, 1998
Introduction Mobile computing is poised to shape the way we live our lives, allowing people to generate, retrieve, and process data anywhere and at any time. The infrastructure for mobile computing is rapidly developing, as…read more
Posted in Blowers / Fans / Filters, Computer, Design, Heat Sinks, Materials, Compounds, Adhesives, Substrates, Semiconductor, Test & Measurement | No Comments »
The need for a change in thermal design philosophy
October 1st, 1995
Figure 1: Standard situation Figure 2: Required situation Introduction The future of many electronic companies will depend to a large extent ontheir ability to initiate techniques that bring schedules, performance, tests,support, production, life cycle costs,…read more
Posted in Design | No Comments »
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