Posts tagged Thermal Interface Materials

Company Launches YouTube Channel for Engineers

January 17th, 2012

Today Fujipoly America announced the launch of a YouTube channel that will provide engineers with 24/7 access to useful technical information on Thermal Interface Materials and Elastomeric Connectors. The company’s first video post includes a…read more

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Common Metallic TIMs in One Kit

March 14th, 2011

This low cost kit from AIM Specialty Materials provides engineers with foils in a range of compositions and thicknesses which can be cut into any configuration for testing and development of effective thermal interfaces in…read more

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Structural Adhesive Cures at Room Temperature

February 4th, 2011

Formulated for structural applications in extreme environments with temperatures from -80°F to +425°F, Master Bond Supreme 33 has superior resistance to thermal cycling, thermal shock and impact. This toughened, two-component epoxy offers high structural bond…read more

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Thermal Company Partners With Packaging Services Firm

February 4th, 2011

Thermal Engineering Associates (TEA) is partnering with engineering services firm, Package Science Services (PSS) to provide measurement, modeling and simulation of IC packages for a number of its customers. The pooling of TEA and PSS…read more

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Groups Develop Thermal Nanotape for Packaging

February 4th, 2011

(a) A nanostructured interface material is used around the module; (b) a nanostructured interface material is used between the thermoelectric material and metal leads. Semiconductor Research Corporation (SRC) and researchers from Stanford University have developed…read more

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Testing Thermal Interface Material (TIM) Analysis

January 25th, 2011

2-3 p.m., March 10 This webinar will provide an introduction to the most commonly used Thermal Interface Material (TIM) types and their corresponding testing techniques. Basic TIM properties such as bulk or effective thermal conductivity,…read more

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editoral: why standardization is mandatory: on the incorrect use of thermal impedance in the TIM world

September 13th, 2010

Clemens J.M. Lasance Editor-in-Chief, Fall 2010 Issue Some time ago I devoted my editorial to the problems caused by the veeerrryyy slow adherence to the use of SI units to which the U.S. committed itself…read more

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product & industry news

September 13th, 2010

Ultra-Thin Waterproof Piezoelectric Speaker Murata Electronics North America recently launched an ultra-thin waterproof piezoelectric speaker. With a thickness of only 0.9mm, this 19.5mm x 14.1mm speaker enables greater design freedom for the rapidly growing and…read more

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Heat Sink Reliability Risks from Thermal Greases

May 25th, 2010

ATS Thermal Labs has published a white paper, “Long term Thermal Grease Reliability.” It considers how long term heat sink reliability is affected by the use of thermal greases as thermal interface materials. The implications…read more

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High-Performance Thermal Putty

May 10th, 2010

Fujipoly has released SARCON XR-Um-Al, a thermal interface silicone putty. The gap filler compound’s putty-like consistency contributes to the material’s low contact and thermal resistance while maintaining a thermal conductivity of 17 watt/m-k. SARCON XR-Um-Al…read more

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Carbon Nanotubes as High Performance Thermal Interface Materials

April 30th, 2010

Introduction Because of substantial increases in the power density of electronic packages over the past few decades, thermal interface resistance can comprise more than 50% of the total thermal resistance in current high-power packages [1].…read more

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New heat sink series provide secure attachment with minimum of board real estate

April 6th, 2010

Alpha’s series of heat sinks feature an innovative attachment mechanism. Electronic components have become faster and more compact, generating more heat and increasing thermal densities. This has led to the use of heat sinks of…read more

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Mini- and Microchannels in Thermal Interfaces: Spatial, Temporal, Material, and Practical Significance

February 1st, 2009

Introduction The role of thermal interface materials (TIM) to augment heat flow in electronics has been well-documented [1-4]: Higher thermal conductivity (k) and thinner bondlines proportionally reduce the interface thermal resistance (RTH). Today’s high-performance TIMs…read more

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Reliability Testing Of Thermal Greases

November 1st, 2007

Introduction Thermal Interface Materials (TIMs) play a key role in the thermal management of electronic systems by providing a path of low thermal resistance between the heat generating devices and the heat spreader/sink. Typical TIM…read more

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