ATS Thermal Labs has published a white paper, “Long term Thermal Grease Reliability.” It considers how long term heat sink reliability is affected by the…read more
Heat Sink Reliability Risks from Thermal Greases
May 25th, 2010
Posted in Applications, Heat Sinks, News, TIMs | No Comments »
High-Performance Thermal Putty
May 10th, 2010
Fujipoly has released SARCON XR-Um-Al, a thermal interface silicone putty. The gap filler compound’s putty-like consistency contributes to the material’s low contact and thermal resistance…read more
Posted in Applications, Materials, Compounds, Adhesives, Substrates, New Products | No Comments »
carbon nanotubes as high performance thermal interface materials
April 30th, 2010
Introduction
Because of substantial increases in the power density of electronic packages over the past few decades, thermal interface resistance can comprise more than 50%…read more
Posted in Applications, Materials, Compounds, Adhesives, Substrates | No Comments »
New heat sink series provide secure attachment with minimum of board real estate
April 6th, 2010
Alpha’s series of heat sinks feature an innovative attachment mechanism. Electronic components have become faster and more compact, generating more heat and increasing thermal densities.…read more
Posted in Applications, Heat Sinks, New Products | 1 Comment »
Mini- and Microchannels in Thermal Interfaces: Spatial, Temporal, Material, and Practical Significance
February 1st, 2009
Introduction
The role of thermal interface materials (TIM) to augment heat flow in electronics has been well-documented [1-4]: Higher thermal conductivity (k) and thinner bondlines proportionally…read more
Posted in Applications, Materials, Compounds, Adhesives, Substrates, TIMs | No Comments »
Reliability Testing Of Thermal Greases
November 1st, 2007
Introduction
Thermal Interface Materials (TIMs) play a key role in the thermal management of electronic systems by providing a path of low thermal resistance between the…read more
Posted in Materials, Compounds, Adhesives, Substrates, TIMs, Test & Measurement | No Comments »
Top 20 Considerations For Selecting Thermal Interface Materials
August 1st, 2007
Introduction
Heat is often considered the limiting factor in the advancement of electronics systems. Lower thermal resistance will drive, not follow, future electronic designs. These solutions…read more
Posted in Design, TIMs | No Comments »
Adhesion of thermal interface materials for cpu heatsinks, an overlooked issue
February 1st, 2007
Figure 1. Test joint break load for a range of TIM types. Note that, by definition, PCMs go through a solid/liquid transition above the melting…read more
Posted in Technical Brief | No Comments »
Direct Die Attach Using a Room Temperature Soldering Process
May 1st, 2006
As the power and power density of IC components continue to rise [1], the need to effectively dissipate the heat to ensure long-term reliability has…read more
Posted in Materials, Compounds, Adhesives, Substrates, Semiconductor, Technical Brief | No Comments »
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