Formulated for structural applications in extreme environments with temperatures from -80°F to +425°F, Master Bond Supreme 33 has superior resistance to thermal cycling, thermal shock and impact. This toughened, two-component epoxy offers high structural bond strength to a wide variety of substrates including metals, glass, ceramics, wood, vulcanized rubbers and many plastics. Supreme 33 also resists chemicals including water, oil and many organic solvents.
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Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
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