TIMs are vital in optimizing the performance, reliability, and longevity of optical components, such as silicon photonics transceivers in data centers. At Thermal Live Spring 2025, Henkel provided valuable insights into the growing computational demands in data centers and the associated thermal stress risks, highlighting how their thermal interface materials are addressing … [Read more...]
Miniaturization a Driving Force in Thermal Management Technologies Market
By 2016 the thermal management technologies market will be worth nearly $11 billion, compared with a 2010 value of $7.5 billion and $8 billion in 2011. According to a new report available on companiesandmarkets.com, this robust market growth is being driven by the significant progression in the technologies associated with - and the demand for - electronic systems and … [Read more...]
Report Reviews Thermal Interface Material Market
A report from marketing research company Japan Marketing Survey (JMS), “Outlook of Thermal Interface Material Market 2010,” offers data on the thermal interface material market and thermal filler market. The report is organized by market size, manufacturers’ share, application and type. To download the report, go to JMS. … [Read more...]
Structural Adhesive Cures at Room Temperature
Formulated for structural applications in extreme environments with temperatures from -80°F to +425°F, Master Bond Supreme 33 has superior resistance to thermal cycling, thermal shock and impact. This toughened, two-component epoxy offers high structural bond strength to a wide variety of substrates including metals, glass, ceramics, wood, vulcanized rubbers and many plastics. … [Read more...]
Thermal Company Partners With Packaging Services Firm
Thermal Engineering Associates (TEA) is partnering with engineering services firm, Package Science Services (PSS) to provide measurement, modeling and simulation of IC packages for a number of its customers. The pooling of TEA and PSS resources provides thermal measurement and modeling capability for IC, diode, transistor, LED, and PV devices and related packaging alternatives. … [Read more...]
