Introduction Heat is often considered the limiting factor in the advancement of electronics systems. Lower thermal resistance will drive, not follow, future electronic designs. These solutions must be cost effective, user friendly and developed quickly.…read more
Top 20 Considerations For Selecting Thermal Interface Materials
August 1st, 2007
Posted in Design, TIMs | No Comments »
Adhesion of thermal interface materials for cpu heatsinks, an overlooked issue
February 1st, 2007
Figure 1. Test joint break load for a range of TIM types. Note that, by definition, PCMs go through a solid/liquid transition above the melting temperature (Tmelt). In the solid phase, PCMs, typically wax-based, show…read more
Posted in Technical Brief | No Comments »
Direct Die Attach Using a Room Temperature Soldering Process
May 1st, 2006
As the power and power density of IC components continue to rise [1], the need to effectively dissipate the heat to ensure long-term reliability has increased [2]. The largest contributor to the total thermal resistance…read more
Posted in Materials, Compounds, Adhesives, Substrates, Semiconductor, Technical Brief | No Comments »
GCS Theory Applied to Thermal Interface Materials
November 1st, 2005
There are 819 kinds of Thermal Interface Material (TIM) – those greases, putties, pads and phase change compounds that go between hot electronic components and their heat sinks – and just as many ways to…read more
Posted in Kordyban's Korner, Materials, Compounds, Adhesives, Substrates, TIMs | No Comments »
Thermal Interface Materials: A Brief Review of Design Characteristics and Materials
February 1st, 2004
Introduction In the past few decades, as microprocessors have continued to evolve along Moore’s law, providing increased functionality and performance, there has been an associated increase in cooling demand driven both by the increase in…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, TIMs | No Comments »
Problems with Thermal Interface Material Measurements: Suggestions for Improvement
November 1st, 2003
Preface Increasingly it is apparent that measuring the thermal properties of Thermal Interface Materials (TIMs) causes much irritation for vendors and users alike. This article focuses on various measurement and standardization aspects and offers a…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Test & Measurement, TIMs | No Comments »
Thermal Interface Materials
November 1st, 2003
It doesn’t take long for an electronics assembler to realize that a thermal interface material (TIM) is essential when two or more solid surfaces are in the heat path. Standard machined surfaces are rough and…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, TIMs | No Comments »
Calculations for Thermal Interface Materials
August 1st, 2003
It’s no news to any of the readers of this publication that the increased power dissipation of integrated circuits has led to continuous refinement of package designs and component materials. This trend has increased the…read more
Posted in Calculation Corner, Design, Materials, Compounds, Adhesives, Substrates, TIMs | No Comments »
Understanding Phase Change Materials
May 1st, 2002
Although phase change materials (PCM) were introduced nearly twenty years ago, it was not until the development of the high-powered Pentium processor that this class of interface material gained widespread acceptance. The large quantities of…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Technical Brief, Test & Measurement, TIMs | No Comments »
Test methods for characterizing the thermal transmission properties of phase-change thermal interface materials
May 1st, 1999
All phase change thermal interface materials are designed to minimize the thermal resistance in an interface between a heat generating component and a heat sink. How well they achieve this goal in a specific application…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Test & Measurement, TIMs | No Comments »
Thermal Interface Materials
September 1st, 1996
Thermattach thermally conductive adhesivetapes Introduction Today’s semiconductors, whether discrete power or logic ICs, are smaller,run faster, do more and generate more heat. Some microprocessors dissipatepower levels that were once the exclusive domain of discrete power…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, TIMs | No Comments »
Thermal resistance of interface materials as a function of pressure
September 1st, 1996
A very large factor in reducing thermal interface resistance is theapplication of pressure. Even though much effort in recent years has beendevoted to improving the thermal conductivity of interface materials, thethermal conductivity of a material…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Technical Brief, Test & Measurement, TIMs | No Comments »
Recent Posts
- Researchers Control Heat Flow with Atoms
- SEMICON West 2012
- Summer Heat Transfer Conference
- IMS2012 International Microwave Symposium
- Multi-Port Cages with Thermal Management
- 55°C Cooling Performance Thin-Film Thermoelectric Coolers
- A Little Goes A Long Way (But A Lot Doesn’t Go Much Further)
- Significant Changes to the NFPA 70E Standard 2012 Edition
Latest Issue
Don’t miss out on
the March 2012 issue
of Electronics Cooling, which includes the 2012 Buyers' Guide as well as features on ionic winds, heat spreading, thermal ground plane technology, and microchannel cooling.
View Issue »
Most Popular Posts
- The Thermal Conductivity of Moist Air 4 comment(s)
- The Seebeck Coefficient 2 comment(s)
- Simplified Formula for Estimating Natural Convection Heat Transfer Coefficient on a Flat Plate 0 comment(s)
- Heat pipes for electronics cooling applications 7 comment(s)
- Advances In High-Performance Cooling For Electronics 11 comment(s)
- Notes on using thermocouples 5 comment(s)
- Estimating Parallel Plate-Fin Heat Sink Thermal Resistance 1 comment(s)
- All you need to know about fans 1 comment(s)
- Air Flow through Cooling Technology for Aerospace Systems - http://t.co/MhAiN39R #
- Still Haven’t Downloaded the Electronics Cooling Buyers’ Guide App? Download it today & see what you are missing - http://t.co/slVy0vYX #
- Cold Atoms Simulate Graphene - http://t.co/acjUaMBp #
- Thermal Ground Plane Vapor Chamber Heat Spreaders for High Power & Packaging Density Electronic Systems - http://t.co/uZ4Czy5S #
