As noted previously in this column, the trend of increasing electronic module power is making it more and more difficult to cool electronic packages with air. As a result there are an increasing number of…read more
Estimating Parallel Plate-Fin Heat Sink Thermal Resistance
February 1st, 2003
Posted in Calculation Corner, Design, Heat Sinks | 1 Comment »
An alternative approach to junction-to-case thermal resistance measurements
May 1st, 2001
As more and more integrated circuits dissipate power at levels once reserved for power discrete devices, junction-to-case thermal resistance (JC or RJC) remains as important as ever. The difficulties in making JC measurements often leads…read more
Posted in Design, Heat Sinks, Test & Measurement | No Comments »
Determining the junction temperature in a semiconductor package, part IV – localized heat generation on the die
September 1st, 2000
In the standard thermal test environment, thermal test chips are designed to dissipate the applied power uniformly over most of the die surface. However, in many situations of practical interest, the power is dissipated over…read more
Posted in Calculation Corner, Computer, Design, Materials, Compounds, Adhesives, Substrates, Semiconductor | No Comments »
Use of junction-to-board thermal resistance in predictive engineering
January 1st, 1999
The readers of “Electronics Cooling” are familiar with the reasons why the junction to ambient thermal resistance [1], JA or RJA, is an inadequate description of the thermal performance of an integrated circuit. Likewise, you…read more
Posted in Design, Test & Measurement | No Comments »
Thermal resistance: an oxymoron?
May 1st, 1997
Introduction Dark light, deafening silence, cruel kindness, living dead, fuzzy logic,honest politics. The adjectives seem to contradict the substantives; such afigure of speech is called an oxymoron. It will be argued within this articlethat ‘thermal…read more
Posted in Design | No Comments »
How to select a heat sink
June 1st, 1995
With the increase in heat dissipation from microelectronics devices and thereduction in overall form factors, thermal management becomes a more a moreimportant element of electronic product design. Both the performance reliability and life expectancy of…read more
Posted in Design, Heat Sinks, Semiconductor, Test & Measurement | 1 Comment »
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