Posts tagged Thermal

Heat Sink for Packing Densities up to 100W/cm2

March 26th, 2012

Ceramtec’s CeramCool Box is made for homogeneous and efficient cooling of packing densities up to 100W/cm2. For example, with an edge length of just 16 x 40 x 40 mm it has a total cooling…read more

Posted in Heat Sinks, LED / Lighting, New Products | 1 Comment »

Tags: , , ,

Thermal Solutions Company Earns AS9100 Rev. C Certification

March 26th, 2012

Thermacore, Inc. has achieved AS9100:2009 Rev. C certification and was re-certified to ISO 9001:2008. AS9100 Rev. C imposes a number of requirements for the business process that must be fulfilled to achieve customer satisfaction, including…read more

Posted in Coolers, New Products | 1 Comment »

Tags: , ,

Diamond-Thin Films Cool Electronics

March 26th, 2012

Two new studies performed at the U.S. Department of Energy’s Argonne National Laboratory have revealed a new pathway for materials scientists to use previously unexplored properties of nanocrystalline-diamond thin films. The unusually attractive thermal properties…read more

Posted in Heat Sinks, News | No Comments »

Tags: , , ,

Slim Form Factor Liquid Cooling for Laptops and All-In-Ones

March 26th, 2012

Asetek Inc. announced today a new slim form factor liquid cooling technology for extreme performance and workstation grade laptops and All-In-One PCs. The fundamental challenge in cooling desktop replacement laptops and All-In-One PCs is the…read more

Posted in Liquid Cooling, News | No Comments »

Tags: , ,

Nanoparticles Increase Thermal Properties of Transformer Oil

February 27th, 2012

Rice University scientists have created a nano-infused oil that could greatly enhance the ability of devices as large as electrical transformers and as small as microelectronic components to shed excess heat. Research in the lab…read more

Posted in Liquid Cooling, News, TECs, Test & Measurement | 2 Comments »

Tags: , ,

Guidelines for Reporting and Using Electronic Package Thermal Information

November 22nd, 2011

This document provides guidelines for both reporting and using electronic package thermal information generated using JEDEC JESD51 standards. By addressing these two areas, this document can be used as the common basis for discussion between…read more

Posted in Standards | No Comments »

Tags:

An Introduction to Solar Photovoltaic Cell Thermal Measurements

July 26th, 2010

Bernie Siegal Thermal Engineering Associates, Inc. Introduction One of the key power generation technologies in the current “green” revolution is the solar photovoltaic cell (SPVC). This unit directly converts solar energy into useful amounts of…read more

Posted in | No Comments »

Tags: , ,

Comparing Liquid Coolants From Both A Thermal And Hydraulic Perspective

August 1st, 2006

In the May 2006 issue the Calculation Corner focused on the comparison of liquid coolants using the Mouromtseff number [1]. For single phase forced convection, Mouromtseff found this figure of merit, Mo, to follow the…read more

Posted in Design, Liquid Cooling, Technical Brief, Test & Measurement | No Comments »

Tags: , ,

EMC and Thermal Design Conflicts in a PC

November 1st, 2002

Thermal and EMC design in high-speed digital electronics systems has become a battle of conflicting requirements. Faster switching has led to increased electromagnetic (EM) emissions due to the extended bandwidth of signals. Higher-density components are…read more

Posted in Design, Test & Measurement | No Comments »

Tags: , , , ,