This document provides guidelines for both reporting and using electronic package thermal information generated using JEDEC JESD51 standards. By addressing these two areas, this document can be used as the common basis for discussion between…read more
Guidelines for Reporting and Using Electronic Package Thermal Information
November 22nd, 2011
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An Introduction to Solar Photovoltaic Cell Thermal Measurements
July 26th, 2010
Bernie Siegal Thermal Engineering Associates, Inc. Introduction One of the key power generation technologies in the current “green” revolution is the solar photovoltaic cell (SPVC). This unit directly converts solar energy into useful amounts of…read more
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Comparing Liquid Coolants From Both A Thermal And Hydraulic Perspective
August 1st, 2006
In the May 2006 issue the Calculation Corner focused on the comparison of liquid coolants using the Mouromtseff number [1]. For single phase forced convection, Mouromtseff found this figure of merit, Mo, to follow the…read more
Posted in Design, Liquid Cooling, Technical Brief, Test & Measurement | No Comments »
EMC and Thermal Design Conflicts in a PC
November 1st, 2002
Thermal and EMC design in high-speed digital electronics systems has become a battle of conflicting requirements. Faster switching has led to increased electromagnetic (EM) emissions due to the extended bandwidth of signals. Higher-density components are…read more
Posted in Design, Test & Measurement | No Comments »
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