The heat transfer coefficient is used to describe convective heat transfer between a solid and a fluid, as in Equation (1). The heat transfer coefficient is a defined parameter, not a physical property like thermal conductivity, and different definitions are used for different situations. The preferred definition for use in the electronics-cooling situation is … [Read more...]
Archives for 2004
Estimating The Effect Of Flow Bypass On Parallel Plate-Fin Heat Sink Performance
In past issues of Electronics Cooling, methodologies were presented for estimating parallel plate-fin heat sink thermal resistance [1] and pressure drop [2]. The underlying assumption for both articles was that all the flow delivered by the fan is forced to go through the channels formed between the fins. As noted in the second article this is often not the case and much of the … [Read more...]
Air Cooled Compact Heat Exchanger Design For Electronics Cooling
Introduction This article will discuss air-cooled compact heat exchanger design using published data. Kays & London's Compact Heat Exchangers [1] contains measured heat transfer and pressure drop data on a variety of circular and rectangular passages including circular tubes, tube banks, straight fins, louvered fins, strip or lanced offset fins, wavy fins and pin fins. … [Read more...]
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