Innovative Research, Inc. recently released TileFlow 4.2, a new version of its three-dimensional software tool for simulating cooling performance of data center. TileFlow now allows users to include upflow CRAC units in the data center layouts. For these units, the dimensions, the details of the return and supply openings, the flow rate, and the cooling characteristics are specified through upflow CRAC unit styles. The supply openings are always located on the top face, but the return openings can be on any of the five remaining faces.
For more product information, visit Innovative Research.
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Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
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