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Electronics Cooling

Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting

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Thermally Conductive Printed Circuit Board Substrate

Applications, Articles, Computer, Industry Updates, LED / Lighting, Materials, Compounds, Adhesives, Substrates, New Products , ,

Laird Technologies, Inc. recently announced the release of its enhanced Tlam™ SS LLD for use as a thermally conductive printed circuit board (PCB) substrate. The Tlam SS LLD is a versatile, thermally enhanced PCB substrate system specifically designed for heat dissipation in bright and ultra-bright LED module applications. The thermally conductive PCB substrate provides 8-10 times the heat dissipation as compared to conventional FR4-based PCBs; a key ability in keeping components cool.

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  • Electronics Cooling

    Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.

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About the Author

Electronics Cooling

Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.

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