Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting
Laird Technologies, Inc. recently released its new Tflex™ XS400 Series thermal gap filler, offering a compliant elastomer gap filler specifically designed to provide moderate thermal performance with a thermal conductivity of 2.0 W/mK. This soft interface pad conforms with minimal pressure, resulting in minimal thermal resistance even at low pressure with little or no stress on mating parts.
Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
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