The new Tactilus® heat-sink analysis system by Sensor Products Inc. enables research and design engineers to quickly and precisely test and correct the surface contact and pressure distribution between the heat sink and its source. Even a slight warping of the heat exchange structure or reduction in surface contact area can have a profound effect on cooling efficacy. If the pressure distribution is not uniform, heat conduction will be low, and the electronics may overheat.
With Tactilus®, engineers can visualize actual contact forces and pressure distribution data on the circuit board components. As the mounting screws between the CPU and the heat sink are torqued, Tactilus® maps and measures the changing pressure distribution between the mating surfaces and displays it through its software. The heat sink interface can be tested, manipulated, and repositioned in real-time, speeding the trial and error process and eliminating the need for additional assembly. Tactilus® also provides the pressure data needed for FEA simulation predictions.
For additional information, contact Sensor Products Inc.
