AOS Thermal Compound’s Micro-Faze® 3 A-4 is a non-silicone thermal pad that exhibits extremely low thermal resistance. It was designed to replace phase change materials and even high performance thermal grease. The pad is composed of 1 mil films of high thermal conductivity, tacky, but dry-to-the-touch thermal grease on either side of a 2 mil aluminum foil substrate. The material does not require heat to form into place; it will perform even with low mounting pressure. It can be die-cut to any size and is highly resistant to degradation and pump-out.
About the Author
Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.