A GM article explaining the Chevrolet Volt’s cooling/heating systems notes that the power electronics coolant loop is designed to insure the main underhood electronics do not overheat during use. It is essential that the heat developed by the power inverter module and the plug-in battery charger while operating the Volt or when plugged in be dissipated in order to prevent … [Read more...]
Archives for 2010
Federal Government Data Center Consolidation Under Way
Now that the first two phases of the federal government’s long-term data center consolidation effort have been completed, the plan to reduce the number of federal data centers by 40% by 2015 has been put into effect. In June, President Obama issued a memo instructing agencies to adopt a zero-growth strategy for data center space over the near term, to be followed by a reduction … [Read more...]
ElectronicsCooling Winter 2010 Issue
Don’t miss out on the Winter 2010 issue of ElectronicsCooling, which includes a sneak peek at SEMI-THERM 27, feature articles on open bath immersion cooling, and energy consumption of data centers, as well as technical briefs. If you would like to receive your free copy of ElectronicsCooling click here to subscribe. Read the Winter 2010 issue here. … [Read more...]
Editorial
Robert Simons Editor-in-Chief, Winter 2010 Issue Resolutions As you read this editorial we are fast approaching the end of another year. For some, this is a time for introspection. Who has not, at sometime, looked back at the past year in their personal life, maybe reflecting upon what they accomplished, would have liked to accomplish, and what they did not accomplish? If you, … [Read more...]
Calculation Corner: Thermal Interactions Between High-Power Packages and Heat Sinks, Part 1
Bruce Guenin, PhD Associate Technical Editor The need to accommodate increasing chip power has led to improved package and heat sink designs having much lower thermal resistance values than previously. This has led to challenges in accurately calculating the thermal performance of the package and heat sink as an integral unit on the basis of thermal resistance measurements … [Read more...]
- « Previous Page
- 1
- 2
- 3
- 4
- 5
- 6
- …
- 46
- Next Page »