Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting
April 7, Newark, N.J.
This New York data center discussion panel event and reception delivers tactics and strategies to address the hottest issues: next-stage virtualization, the impact of cloud computing, best practices in cost optimization, managing escalating energy costs, the aging infrastructure, and more.
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Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
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