
- High thermal conductivity up to 7.0 w/mºk , low thermal resistance of 0.01°C-In2 /W
- Low viscosity & excellent wetting properties allows screen printing/Stencil method to apply precise bond line thickness.
- Available in Non Silicone, Silicone and high temperature (up to 360°C) formulas
Download Timtronics white paper
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Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.







