Rao R. Tummala, a researcher and educator who has made seminal contributions to microelectronics packaging, has been honored by IEEE with the 2011 IEEE Field Award in Components, Packaging and Manufacturing Technologies. The award recognizes Tummala for pioneering inventions such as the industry’s first plasma display and the first (and next three generations of) multichip packaging based on ceramics and polymer copper thin film interconnections. His Low Temperature, Co fired Ceramic (LTCC) technology resulted in the first 100 chip multichip module. Tummala also introduced the SOP concept, which provides high functionality in a small size compared to the traditional systems on bulky boards.
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Researcher Receives IEEE Field Award
