Mouser Electronics, Inc. and The Bergquist Company have signed a global distribution agreement. Under the new agreement, Mouser will distribute Bergquist’s portfolio of thermal management materials, which includes Sil-Pad®, thermally conductive insulators and various specialty materials, plus Gap Pad®, gap filling materials, phase change materials, and Bond-Ply®.
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Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.







