
CarbAl™ has a density of 1.75 g/cm3 compared to 2.7 g/cm3 for aluminum and 8.9 g/cm3 for copper. While copper has a slightly higher thermal conductivity than CarbAl™, 390 W/mK compared to 350 W/mK, CarbAl’s thermal diffusivity is approximately 2.9 cm2/sec compared to 0.84 cm2/sec for aluminum and 1.12 cm2/sec for copper.
Learn more from Applied Nanotech.
Author
-
Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
View all posts







