Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting
CoolIT’s new Rack Direct Contact Liquid Cooling (Rack DCLC) technology offers cooling for increased density and decreased power usage.
DCLC moves the heat generated by high performance processors by circulating liquid directly across the CPU. CoolIT’s pure copper micro-channel technology allows for the absorption of heat, which is then transported away from temperature sensitive components using liquid.
Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
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