Don’t miss out on the September 2012 issue of Electronics Cooling, which includes feature articles on thermal load board design considerations, JEDEC thermal standards, detailed system level modeling of LEDs, and much more.
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Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.





