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New Silicone Potting and Encapsulating Compound for Rapid Thermal Transfer

Materials, Compounds, Adhesives, Substrates, New Products

Epoxies, Etc., a manufacturer of thermal management compounds, epoxies and adhesives, has released a new silicone potting and encapsulating compound. According to the company, the 50-1952 is formulated for rapid thermal transfer away from heat-generating electronic devices.

The new silicone compound is made of flexible material to protect electronics from vibration and impact and is solvent-free. 50-1952 exhibits an operating temperature range of -65 to 235°C (-85°F to 455°F) and a 1:1 mix ratio.

For more information, visit ThomasNet.

Author

  • Electronics Cooling

    Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.

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About the Author

Electronics Cooling

Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.

@e_cooling

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