Thermal solutions company Thermacore, Inc. has released a new product line of compact, high-performance air-cooled heat sinks. According to the company, the new generation of heat sinks is the result of a multimillion-dollar development contract from the Defence Advanced Research Projects Agency (DARPA).
As part of the DARPA Micro-Technologies for Air-Cooled Exchangers (MACE) program, Thermacore developed four varieties of passive heat sink products for “improved airside heat transfer performance over existing state-of-the-art heat sinks.”
“We’re excited about the possibilities of this new design for meeting difficult microprocessor cooling challenges, including those found in military applications,” said Nelson Gernert, vice president of engineering and technology at Thermacore.
The heat sink design integrates the company’s vapor chamber technology into a three-dimensional thermal solution. Vapor flow spreads heat both laterally within the base and into the planar appendage heat pipe blades, where high-density fins are attached to enhance thermal performance.