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Thermal solutions developer JARO Thermal has released the new “skive” cooler comprised of a 50x50x13 mm fan embedded inside a skived-copper-fin heat sink for low-profile applications including network interface cards, video graphic cards, PCI express and IC spot cooling.
According to the company, “the dense arrangement of thin copper fins offers unheralded thermal conductivity,” allowing for powerful cooling in a small space. Fin thickness and pitch are customizable.
Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
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