Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting
July 14-19, 2013
Minneapolis, Minnesota
“This conference will bring together international researchers and engineers focusing on heat and mass transfer in a variety of applications. The objectives of the meeting are to provide a forum for presentation of state-of-the-art research and opportunities for technical interactions among participants. The conference will also celebrate . . . the 75th anniversary of the ASME Heat Transfer Division.”
For more information, visit ASME.
Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
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