October 23-25, 2013
Taipei, Taiwan
Thermal Management Expo Taiwan 2013, part of the Taiwan Printed Circuit Association Show, will cover a wide range of topics pertaining to electronics thermal management, including thermal design, product development and applications, and thermal measurement and modeling.
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Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.





