Indium Corporation has announced the release of its new Heat-Spring® thermal interface material, which was featured at PCIM this month in Nuremberg, Germany.
Heat-Spring is a patented technology designed to deliver superior performance compared to thermal greases or other metal TIMs. Heat-Springs offer uniform thermal resistance at lower applied stresses in compressed interfaces. The malleability of the Heat-Spring minimizes surface resistance and increases heat flow. Heat-Springs do not experience pump-out even under repeated power cycling.
Heat-Springs are available in a variety of alloys, such as Sn+, In, or InSn, and are offered in a different forms to meet the needs of any application.