Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting
Thermal Engineering for Transport: Optimal Thermal Simulation and Design Under Key Weight, Space and Cost Considerations
June 2, 2016
United Kingdom
“Key topics covered include:
Thermal modelling and simulation
Packaging, integration and design
Thermal energy management
Thermal energy flow
Utilising excess heat and thermal energy
The latest developments and challenges in materials and composites”
Read more here.
Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
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