Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting
Don’t miss out on the June 2016 Issue of Electronics Cooling, which includes feature articles on The Hidden Risk of Invisible Airflow Imbalance in Data Centers, Application of Phase Change Materials in Handheld Computing Devices, and more.
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Read the June 2016 issue here
Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
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