SHIN-ETSU SILICONES LAUNCHES CLG SERIES GAP FILLERS WITH IMPROVED RESISTANCE AGAINST PUMP-OUT FOR ADVANCED THERMAL MANAGEMENT ELECTRONICS APPLICATIONS.
Akron, OH | February 2018 – In an effort to provide progressive options to thermal engineers in the growing electronics cooling market sector for silicone TIM (Thermal Interface Materials), Shin-Etsu Silicones of America, Inc. (SESA: A U.S. subsidiary of Shin-Etsu Chemical Co. Ltd., Japan) recently premiered its CLG Series singlecomponent, pre-cured Gap Filler product line. SESA’s CLG Series materials are ideal for a broad base of general electronics cooling applications–offering a wide range of thermal conductivity.
A U.S. subsidiary of Shin-Etsu Chemical Co. Ltd., Japan, Shin-Etsu Silicones of America Inc. offers vast technical and capital resources to formulate solutions as a major supplier of silicone materials to North America’s medical, automotive, electronics, aerospace, cosmetics, and manufacturing industries. Shin-Etsu’s premium silicone compounds incorporate leading-edge technology, staff expertise, and value-added service; offering customers the highest levels of quality and consistency in specialty silicone materials.