Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting
February 28, 2013 – Munich, Germany
June 6, 2013 – Stuttgart, Germany
Hosted by Mentor Graphics, this course uses intensive mathematics to enhance the physical understanding of thermal behavior. Course topics include heat transfer and friction in moving fluids, interface materials, measurement methods for temperature and flow and the integration of simulation and measurement into the development process.
Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
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