
Photo: Purdue University doctoral student Tannaz Harirchian holds up special chips that she and Professor Suresh Garimella used to simulate what happens in a real chip.
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Photo: Purdue University doctoral student Tannaz Harirchian holds up special chips that she and Professor Suresh Garimella used to simulate what happens in a real chip.
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Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
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