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Electronics Cooling

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Call for Papers: 62nd ECTC

Industry Updates

Oct. 10

Mark your calendars! October 10, 2011 is the deadline to submit an abstract and/or a Professional Development Course (PDC) proposal about new developments and technology related to the following:

  • Advanced Packaging
  • Applied Reliability
  • Assembly and Manufacturing Technology
  • Electronic Components & RF
  • Emerging Technologies
  • Interconnections
  • Materials & Processing
  • Modeling & Simulation
  • Optoelectronics
  • Interactive Presentations (formerly Posters)

Submission Guidelines
The content must be original, previously unpublished, non-confidential and without commercial content.

Learn more.

Author

  • Electronics Cooling

    Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.

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About the Author

Electronics Cooling

Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.

@e_cooling

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